With the maturation of the smartphone market, smartphone brands face increasing difficulties in launching innovative products. At the same time, consumers lack compelling reasons to replace their exis...
The automotive market is witnessing a surge of interest in silicon carbide (SiC) power semiconductor devices. Presently, SiC power devices still lag behind traditional silicon-based IGBTs in terms of...
Following the long COVID-19 pandemic, physical exhibitions finally returned to Computex in 2023. Even though the event did not reach the pre-pandemic level of grandeur, it still attracted significant...
The deployment of FTTH accelerates in regional markets such as Europe, North America, and Southeast Asia. Hence, the major international companies involved in telecommunication, networking equipment,...
Global shipments of notebook (laptop) computers have been rising over the quarters since the start of 2023. Even if the total shipments for the year are comparable to the annual quantities that were s...
The load of cloud computing will continue to elevate under the advancement of diversified applications, where restricted growth of performance in DDR SDRAM could encumber the performance of computing...
Values of AI servers and corresponding computing cores GPGPU (General-Purpose Computing on Graphics Processing Unit) in parallel computing as LLM (Large Language Model), which excels in NLP (Natural L...
1. Display 2. Mini LED/Micro LED/Micro OLED 3. Materials
1. Introduction to Power Components 2. Current Market Status of SiC-MOSFET for NEVs 3. Development Trends of SiC-MOSFET for NEVs 4. TRI’s View
Looking back at 1Q23, the smartphone market had not manifested signs of sale rebounds since China’s mitigation on pandemic-prevention measures in December last...
As indicated by the survey of global market intelligence firm TrendForce, the DRAM industry had generated US$9.663 billion of revenue in 1Q23 under a QoQ deterioration of 21.2% that marked three conse...
Qualcomm, which is the world’s largest supplier of chips used in mobile devices, released its earnings report for 1Q23 on May 4. According to the report, its revenue from smartphone-related chips fell...
The utilization of chiplets paired with 2.5D and 3D advanced packaging technology is bound to become one of the inevitable development trends of high-end chips in order to allow a continuous elevation...
