Since 2H25, accelerated AI infrastructure buildouts by CSPs have surged HBM demand and crowded out conventional DRAM capacity, pushing the broader DRAM market into shortage. Constrained by annual pric...
Major foundries see rising utilization and pricing power, driven by front-loading demand and surging AI orders, lifting 2026 full-year outlook.
2026 server market accelerates on AI demand; CSPs expand CAPEX while OEMs compete via rack-scale and liquid cooling solutions.
This report first explains why HBM plays a key role in the evolution of LLM and AIGC applications. It then examines the HBM upgrade roadmap and explores how heterogeneous memory integration strategies...
AI server demand surges on hyperscale and inference workloads, lifting CSP rack-scale buildout amid grid constraints.
Taiwan foundries see strong 2Q26 rebound, led by TSMC's 3nm ramp and packaging, with peers eyeing HBM and interposer.
As technical iteration narrows the capability gap between models, Chinese open-source models are expanding their global presence by compensating weaker hardware with software optimization and scale. U...
CSP Capex fuels AI server growth; GPU and ASIC engines drive market upgrades as liquid cooling adoption accelerates.
The semiconductor industry is undergoing a structural shift in 2026, with competition moving beyond process node scaling toward system-level architecture. On the technology front, 2nm gate-all-around...
Foundry shifts: Samsung Taylor starts, SMIC expands, HuaHong refines, Nexchip and CXMT ally, mature node prices rise.
Intensifying global geopolitical conflicts are driving up defense spending, and warfare is pivoting toward asymmetric and information warfare, making low-cost unmanned vehicles (UAVs) crucial. China i...
Global CSPs expand AI infrastructure investment, with Google and Microsoft leading on TPU and GPU racks while Chinese peers diversify amid geopolitical constraints.
Vision-language-action (VLA) models have become central to the evolution of autonomous driving. Their key advantage lies in significantly improving generalization in long-tail scenarios while enhancin...
Taiwanese foundries face structural shifts: TSMC consolidates 12" mature nodes, UMC hikes 8" prices, VIS pivots to PMICs, and PSMC moves to high-value processes amid supply-demand restructuring.
AI server demand stays robust with GB leading H1; Rubin ramps in Q3. ASIC share dips slightly as GPU dominates. Component shortages cap general server growth. Liquid cooling competition intensifies.
