[News] China’s NAURA Targets Hybrid Bonding With RMB 405M Deal as Domestic Equipment Push Accelerates
China’s semiconductor equipment makers are stepping up their push into advanced packaging as demand grows for technologies supporting HBM and chiplet integration. According to ETNews and Yicai, China’s largest semiconductor equipment maker, NAURA, plans to acquire a hybrid bonding specialist to strengthen its 3D integration capabilities beyond its core etching and deposition businesses.
As noted by Yicai, NAURA’s wholly owned subsidiary, Beijing NAURA Microelectronics Equipment, signed an agreement with the Beijing Integrated Circuit Equipment Industry Investment and M&A Phase II Fund to acquire a 100% stake in Beijing Nuohe Jianwei Equipment for approximately RMB 405 million in cash.
NAURA has already entered the hybrid bonding market. As Yicai notes, the company unveiled its Qomola HPD30, a 12-inch die-to-wafer (D2W) hybrid bonding system, in March 2026. According to NAURA‘s first-half financial report, its hybrid bonding portfolio covers both wafer-to-wafer (W2W) and D2W technologies for wafer-level 3D integration and heterogeneous chip integration. The company also reported that its D2W system had entered commercial application, while its hybrid bonding products completed customer validation.
The acquisition would further strengthen NAURA’s capabilities. According to Securities Times, Nuohe Jianwei has developed hybrid bonding equipment with nanometer-level alignment accuracy and secured repeat orders. However, its products remain in the technology refinement and market introduction stages, with limited revenue and high R&D spending contributing to losses in 2025 and the first half of 2026.
The move comes as Chinese equipment makers seek a stronger foothold in a market dominated by overseas suppliers. According to Yicai, citing industry analysts, Dutch equipment maker BESI holds approximately 70% of the global hybrid bonding equipment market, with a particularly strong position in the high-end segment. In China, Piotech has introduced its first production-grade hybrid bonding system and secured repeat orders.
Chinese Equipment Makers Expand 3D Integration Portfolios
Chinese semiconductor equipment makers are also expanding their 3D integration capabilities through acquisitions. According to Securities Times, Piotech announced plans to acquire Wuxi Shangji and its related holding companies for RMB 2.5 billion. The deal would add Wuxi Shangji’s mass-produced physical vapor deposition (PVD) equipment to Piotech’s existing PECVD, ALD, and Gap-Fill CVD businesses, strengthening its 3D integration equipment portfolio.
AMEC is also investing in bonding technologies. According to STAR Market Daily, the company announced that its wholly owned subsidiary, Zhongwei Lingang, plans to invest up to RMB 35 million in iSABers, acquiring a 0.50% stake following the funding round. Also known as Qinghe Jingyuan, iSABers specializes in advanced semiconductor bonding technologies, offering high-end bonding equipment and production-line services. Its portfolio includes wafer bonding, chip bonding, and surface treatment equipment.
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(Photo credit: NAURA)
