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Recent Posts
- [News] China’s OSATs Step Up: Tongfu Microelectronics to Raise RMB 4.4B; JCET Backs Chip Fund
- [News] Out with the Old: Memory Giants Map Their 2025-26 Exit Strategy amid Supply Crunch
- [News] Expert Says HBF May Be Deployed in NVIDIA GPUs by 2027–28; Market Could Surpass HBM by 2038
- [News] SK hynix Unveils 5-Bit NAND That Splits Cells, Delivers 20× Faster Reads
- [News] MediaTek Debuts Dimensity 9500s on TSMC 3nm and 4nm 8500, Targeting Upper-Midrange Market
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Monthly Archives: January 2026
[News] Meizu Reportedly Scraps Meizu 22 Air as Memory Costs Drive Price Hikes Across Chinese Brands
Memory price increases are prompting smartphone makers to adjust their production plans. According to South China Morning Post, a global memory chip shortage has led China’s DreamSmart Group to cancel a planned handset launch, with the company confirming that its …
[News] SK hynix to Build Cheongju Advanced Packaging Fab, Boosting HBM Output by 2027
As previously reported by ZDNet, SK hynix is exploring plans for its first U.S. HBM packaging facility. Meanwhile, the memory giant is accelerating its domestic expansion, announcing today a KRW 19 trillion investment in a new advanced packaging fab, P&T7, …
[News] SK hynix May Stick With MR-MUF for HBM4 16-High amid Fluxless Bonding Evaluation
SK hynix is expected to continue using its MR-MUF process for HBM4 16-high products. According to DealSite, the company evaluated adopting fluxless bonding for HBM4 16-high but ultimately opted to retain its existing advanced MR-MUF process, concluding that the technology …
[News] TSMC Reportedly Plans 5 More Fabs in Arizona Under U.S. Trade Deal, Investment Could Top $100B
Just days ahead of its January 15 earnings call, TSMC stepped up its U.S. push with a US$197 million land purchase for a future gigafab — a move that signals the foundry giant is preparing for another major wave of …
[News] Chinese Research Team Achieved New Advances in Lithographic Manufacturing Technology
Focal plane arrays (FPAs) have attracted widespread attention in the field of polarization imaging due to their high level of integration, robustness, and strong dynamic adaptability. The key to fabricating FPAs lies in producing arrayed anisotropic subwavelength gratings. Conventional techniques …