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- [News] China’s OSATs Step Up: Tongfu Microelectronics to Raise RMB 4.4B; JCET Backs Chip Fund
- [News] Out with the Old: Memory Giants Map Their 2025-26 Exit Strategy amid Supply Crunch
- [News] Expert Says HBF May Be Deployed in NVIDIA GPUs by 2027–28; Market Could Surpass HBM by 2038
- [News] SK hynix Unveils 5-Bit NAND That Splits Cells, Delivers 20× Faster Reads
- [News] MediaTek Debuts Dimensity 9500s on TSMC 3nm and 4nm 8500, Targeting Upper-Midrange Market
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Monthly Archives: September 2025
[News] Intel’s Former Interim Co-CEO Michelle Johnston Holthaus to Depart Amid Leadership Shakeup
Since Lip-Bu Tan took over as CEO in March, Intel has continued to reshuffle its leadership. According to the company, Michelle Johnston Holthaus—head of Intel Products—will step down after more than three decades with the firm. Over her tenure, Holthaus …
[News] Silicon Photonics in the Spotlight: TSMC Lifts the Curtain on COUPE at SEMICON Taiwan
As SEMICON Taiwan 2025 kicks off this week, the Silicon Photonics Global Summit took the spotlight on September 8, featuring senior executives from global chip giants such as TSMC, NVIDIA, and Broadcom sharing their latest progress. According to Commercial Times, …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged COUPE, Silicon Photonics, TSMC
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[News] AMD May Return to GPU Arena with the Launch of 2.5D/3.5D Chiplet-Based GPU
AMD may be gearing up for a comeback in the high-performance GPU arena. As per Tom’s Hardware, AMD SoC chief architect Laks Pappu recently revealed on LinkedIn that the company is developing next-generation GPUs with advanced 2.5D and 3.5D chiplet …
[News] TSMC Eyes Breakthroughs in SiC Thermal Management
Recent reports indicate that TSMC is spearheading an initiative with equipment makers and compound semiconductor partners to explore the use of 12-inch monocrystalline silicon carbide (SiC) for thermal substrates, aiming to replace conventional alumina, sapphire, or ceramic substrates. Traditionally, SiC …
[News] U.S. Reportedly Mulls Annual Site License on Exports to Samsung, SK hynix China Fabs
According to Bloomberg, the U.S. is reportedly weighing an annual approval plan for exports of chipmaking equipment to Samsung and SK hynix facilities in China. The measure follows the Trump administration’s decision to revoke Biden-era waivers that had granted the …