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In Addition to Semiconductor Equipment and EDA, US Now Expands Export Restrictions to Include HPC Chips as Its Technology Trade Dispute with China Escalates

Last Modified

2022-09-01

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Global market intelligence firm TrendForce reports that the US government on August 26th sent formal notices to AMD and NVIDIA demanding that...

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In Addition to Semiconductor Equipment and EDA, US Now Expands Export Restrictions to Include HPC Chips as Its Technology Trade Dispute with China Escalates

Overview

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US to Cancel China Exemptions; Case Review Likely to be Approved

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Analysis of TSMC’s North America Technology Symposium: Unveiling of Roadmap for Advanced Packaging Solutions and Related Strategy

Top 10 Global OSAT Companies in 2024—Mature Leaders Stay Strong While New Regional Forces Emerge

TSMC Expands US Investment to US$165 Billion; US Share of Global Advanced Foundry Capacity Will Rise to 22% by 2030

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In Addition to Semiconductor Equipment and EDA, US Now Expands Export Restrictions to Include HPC Chips as Its Technology Trade Dispute with China Escalates

Overview

Spotlight Report

DRAM Monthly Datasheet Jul. 2025

NAND Flash Monthly Datasheet Jul. 2025

DRAM Industry Analysis－2Q25

3Q25 Memory Price Forecast

DRAM Contract Price May 2025

DRAM Contract Price Jun. 2025

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US to Cancel China Exemptions; Case Review Likely to be Approved

Hybrid Bonding Technology Heralds a New Era in Advanced Semiconductor Packaging

Analysis of TSMC’s North America Technology Symposium: Unveiling of Roadmap for Advanced Packaging Solutions and Related Strategy

Top 10 Global OSAT Companies in 2024—Mature Leaders Stay Strong While New Regional Forces Emerge

TSMC Expands US Investment to US$165 Billion; US Share of Global Advanced Foundry Capacity Will Rise to 22% by 2030

Download Report

USD $70,000

Membership

Spotlight Report

DRAM Monthly Datasheet Jul. 2025

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DRAM Industry Analysis－2Q25

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DRAM Contract Price May 2025

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