Supply Chain Bottleneck

Key AI Components – Fiberglass Cloth | TrendForce

Key AI Components – Fiberglass Cloth

Jun 26, 2026 | PDF

The surge in demand for AI chips and high-speed servers is driving the demand for high-end fiberglass cloth. However, constrained by technical barriers, equipment bottlenecks, and yield challenges, th...

2026 Outlook: Global Semiconductor Supply Chain Diversification and Materials Strategy | TrendForce

2026 Outlook: Global Semiconductor Supply Chain Diversification and Materials Strategy

Jun 18, 2026 | PDF

Global semiconductor supply chains are shifting from efficiency to resilience amid escalating export controls, driving manufacturing diversification. Governments race to subsidize domestic ecosystems,...

Cascading Shortages in Consumer DRAM: How Capacity Pivots Fuel Legacy Node Adoption | TrendForce

Cascading Shortages in Consumer DRAM: How Capacity Pivots Fuel Legacy Node Adoption

Jun 17, 2026 | PDF

Driven by AI infrastructure, major DRAM makers shift capacity to advanced nodes, tightening mature processes. To secure supply and control costs, brands downgrade to older generation consumer DRAM, sh...

AI Servers Absorbing LPDRAM Capacity, Signaling Tight Supply as the New Norm | TrendForce

AI Servers Absorbing LPDRAM Capacity, Signaling Tight Supply as the New Norm

Jun 05, 2026 | PDF

Beyond full-rack solutions, NVIDIA is also actively promoting its standalone Vera CPU to capture the AI inference market. However, given the LPDRAM supply bottleneck, NVIDIA has decided to reduce the...

DRAM Industry Analysis-2Q26 | TrendForce

DRAM Industry Analysis-2Q26

Jun 05, 2026 | PDF

Driven by AI expanding into inference, cloud providers are accelerating data center buildouts, triggering a surge in server memory orders. This has caused contract prices to skyrocket and fueled robus...

CPO Technology Revolution: Next-Gen Interconnect for AI Data Centers | TrendForce

CPO Technology Revolution: Next-Gen Interconnect for AI Data Centers

Jun 05, 2026 | PDF

Co-packaged optical (CPO) technology is entering the commercialization stage, driven by AI data center demand for higher bandwidth and lower power consumption. Volume production begins in 2026, with l...

2Q26 HBM Market Dynamics and Forecast | TrendForce

2Q26 HBM Market Dynamics and Forecast

Jun 03, 2026 | PDF

HBM remains irreplaceable in AI accelerators. HBM4 ramps, tight supply lifts prices, and ASIC demand diversifies the supplier base.

Mature Memory Structural Shortage: Price Plateau Era Arrives - 2H26 | TrendForce

Mature Memory Structural Shortage: Price Plateau Era Arrives - 2H26

Jun 02, 2026 | PDF

Capital shifts to high-performance chips have squeezed mature processes, triggering structural shortages in high-reliability memory. As value revaluation outpaces volume growth, market revenue surges....

DRAM Contract Price May 2026 | TrendForce

DRAM Contract Price May 2026

May 29, 2026 | PDF

Driven by strong low-cost laptop sales and active server restocking, supplier inventories remain low, maintaining strong pricing power. PC DRAM contract prices grew significantly in Q2, with the upwar...

HBM Market Outlook:HBM Suppliers Seize Pricing Power as AI Demand Fuels Explosive Contract Price Surge | TrendForce

HBM Market Outlook:HBM Suppliers Seize Pricing Power as AI Demand Fuels Explosive Contract Price Surge

May 27, 2026 | PDF

Since 2H25, accelerated AI infrastructure buildouts by CSPs have surged HBM demand and crowded out conventional DRAM capacity, pushing the broader DRAM market into shortage. Constrained by annual pric...

MLCC Market Outlook 1Q26~2Q26 | TrendForce

MLCC Market Outlook 1Q26~2Q26

May 25, 2026 | PDF

AI infrastructure demand offsets consumer electronics weakness, boosting Japanese and Korean MLCC suppliers' recent revenue and profits. High-end products face tight supply while mid-low tiers se...

MLCC Market Bulletin - May 11, 2026 | TrendForce

MLCC Market Bulletin - May 11, 2026

May 11, 2026 | PDF

Under inflation and warfare, global economy faces uncertainty; Middle East conflicts disrupt supply chains, high energy prices elevate living costs and inflation expectations. Consumer confidence is l...

Mobile DRAM Contract Price 2Q26 | TrendForce

Mobile DRAM Contract Price 2Q26

May 04, 2026 | PDF

Smartphone Mobile DRAM contract prices are maintaining their strong upward momentum in 2Q26. Samsung and Micron were the first to issue quotes, whereas SK hynix and CXMT have only provided tentative p...

DRAM Contract Price Apr. 2026 | TrendForce

DRAM Contract Price Apr. 2026

Apr 30, 2026 | PDF

PC DRAM contract prices rose this quarter, but momentum slowed. High costs weakened PC sales, cooling negotiations and ending the extreme seller's market. Spot markets stabilized, while long-term...

AI Ignites Chip Arms Race for Advanced Capacity | TrendForce

AI Ignites Chip Arms Race for Advanced Capacity

Apr 28, 2026 | PDF

AI demand reshapes chip supply; advanced nodes and packaging turn scarce, with early lockdowns now defining leadership.

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