2027 HBM talks remain stalled as suppliers push steep price hikes amid AI-driven DRAM crowd-out and tighter capacity.
Consumer DRAM remains undersupplied, with contract prices still rising but decelerating as buyer cost tolerance tightens, while spot trading stays subdued. On technology, focus centers on open softwar...
HBM supply expands as shares shift; 2026 is a pricing pause, 2027 brings a sharp ASP surge as HBM4 rises.
DRAM contracts delayed to Aug. Spot market flat on low volume. CSP demand boosts Korean Q2 results and LTA signings.
Robust CSP capex drives AI server growth, led by NVIDIA racks, as ASICs, China's supply chain, and liquid cooling advance.
With mobile DRAM inventory restocking largely completed and demand starting to soften, the urgency of procurement negotiations has diminished, and 3Q26 contract price settlements are likely to be push...
Leveraging TrendForce’s extensive research on the AI supply chain, this report expands its focus to high-growth cloud service providers (CSPs). It offers comprehensive medium-to-long-term forecasts fo...
Server DRAM contract prices are trending upward. Supply shortages and HBM crowding effects strengthen vendor pricing power. High-capacity module premiums are narrowing due to stable yields and demand...
TrendForce: NVIDIA still weighs Rubin Ultra HBM options as tight DRAM supply pushes suppliers toward much higher prices.
Driven by strong demand from cloud service providers, the demand for HBM and server modules has surged. However, constrained by long equipment lead times and capacity reallocation, supply growth conti...
Driven by robust AI server demand and capacity displacement from HBM, combined with delayed output from new fabs, DRAM supply remains tightly constrained, sustaining a seller's market. Conver...
JEDEC-defined SPHBM4 frees HBM from the interposer, trading latency and power for cost and layout.
AI chip demand surges in 2026, with high-end GPUs dominating. NVIDIA leads, ASICs gain share, liquid cooling expands, and AI server value hits record highs.
The AI industry entered a critical transition period in 2025, marked by the rapid expansion of LLMs and the large-scale commercialization of AI applications. For China’s semiconductor industry, this r...
Diverging HBM4 certification timelines are reshaping 2026 market share, with Samsung gaining ground as SK hynix faces delays.
