HBM

NVIDIA Rubin Ramp Delayed to 2027 on HBM Snag | TrendForce

NVIDIA Rubin Ramp Delayed to 2027 on HBM Snag

Sep 21, 2026 | PDF

NVIDIA shipments stay Blackwell-led as Rubin's ramp slips into next year on HBM4 snags, keeping HBM the key bottleneck.

HBM Downgrade Drives KV Cache Offload Demand | TrendForce

HBM Downgrade Drives KV Cache Offload Demand

Sep 21, 2026 | PDF

AI chip makers weigh downgrading HBM capacity, hitting capacity for KV cache, lifting offload memory demand, as 8hi stays mainstream.

AI Compute Surges as ASICs Challenge GPU Dominance | TrendForce

AI Compute Surges as ASICs Challenge GPU Dominance

Sep 15, 2026 | PDF

AI compute surges in 2026 as ASICs rise, NVIDIA defends its ecosystem, and bandwidth becomes the bottleneck.

CSP ASIC Demand Fuels Advanced Packaging Evolution | TrendForce

CSP ASIC Demand Fuels Advanced Packaging Evolution

Sep 11, 2026 | PDF

CSPs scale ASICs alongside GPUs, lifting packaging demand as CoWoS-L leads while EMIB-T and FOPLP emerge as new options.

2Q26 Revenue Ranking among Server DRAM Suppliers | TrendForce

2Q26 Revenue Ranking among Server DRAM Suppliers

Sep 09, 2026 | PDF

In 2Q26, Server DRAM revenue surged 53% QoQ to $75.58B. AI servers drove demand for high-capacity RDIMMs and DDR5. With rock-bottom supplier inventories, average prices rose 53–58%, pushing the supply...

DRAM Market Bulletin - Sep. 9, 2026 | TrendForce

DRAM Market Bulletin - Sep. 9, 2026

Sep 09, 2026 | PDF

RDIMM contract premium narrows on shifting demand, while spot market sees limited trades. Custom HBM (cHBM) optimizes AI chip area and performance via logical base dies, yet faces cooling, multi-sourc...

DRAM Industry Analysis-3Q26 | TrendForce

DRAM Industry Analysis-3Q26

Sep 04, 2026 | PDF

AI servers drive strong demand for conventional DRAM and HBM. Supply tightens, pushing contract prices higher and boosting memory suppliers' revenues. As server applications prioritize capacity, PC an...

2Q26 Revenue Ranking among DRAM Suppliers | TrendForce

2Q26 Revenue Ranking among DRAM Suppliers

Sep 04, 2026 | PDF

Driven by the AI wave, demand for high-capacity memory continues to surge, powering strong industry revenue growth and contract price hikes. Although top suppliers are accelerating advanced process tr...

4hi HBM: Edge AI Appeal, Data Center Limits | TrendForce

4hi HBM: Edge AI Appeal, Data Center Limits

Sep 02, 2026 | PDF

HBM 4hi samples emerge; low capacity curbs data center use; edge interest stays early, supplier uptake cautious.

DRAM Market Bulletin - Sep. 2, 2026 | TrendForce

DRAM Market Bulletin - Sep. 2, 2026

Sep 02, 2026 | PDF

PC DRAM contract prices saw their quarterly increase revised upward, while spot transactions stayed subdued. HBM negotiations remain deadlocked with specifications still in flux, yet prices retain str...

3Q26 HBM Market Dynamics and Forecast | TrendForce

3Q26 HBM Market Dynamics and Forecast

Sep 01, 2026 | PDF

AI demand keeps HBM shipments strong as technology advances and tight supply shifts pricing power toward suppliers.

AI Agents Reshape Memory Hierarchy: Next-Gen NAND | TrendForce

AI Agents Reshape Memory Hierarchy: Next-Gen NAND

Sep 01, 2026 | PDF

AI agents are driving up demand for KV cache and token storage, reshaping memory architecture. Cost considerations are pushing token storage down from expensive HBM and DRAM to SSDs. NAND suppliers ar...

Server DIMM Price Aug. 2026 | TrendForce

Server DIMM Price Aug. 2026

Aug 31, 2026 | PDF

Server DRAM prices rise due to strong demand and HBM capacity crowding out. Buyers shift to mid-to-low capacity modules to optimize costs, while high-capacity stock flows to OEMs, helping suppliers ma...

NVIDIA Data Center Boom Fuels GB/VR Rack Demand | TrendForce

NVIDIA Data Center Boom Fuels GB/VR Rack Demand

Aug 27, 2026 | PDF

NVIDIA's data center strength lifts GB/VR Rack demand, extending its reach into infrastructure and HBM supply.

3Q26 DRAM Diamond Datasheet | TrendForce

3Q26 DRAM Diamond Datasheet

Aug 19, 2026 | EXCEL

TrendForce Offers you a complete analysis on DRAM industry wafer input, production output, technology node…etc. by each company.

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