TrendForce Offers you a complete analysis on DRAM industry wafer input, production output, technology node…etc. by each company.

Key Highlights

• DRAM output is set to grow, but 2026 expansion plans are generally conservative.
• Samsung and SK hynix increase advanced process shares.
• Micron relies on existing sites as US plant delays, pushing rapid process migration.
• Nanya boosts capacity and next-gen process use due to strong DDR4/LPDDR4(X) demand.
• Winbond mostly flat output, shifting focus to advanced nodes.
• PSMC maintains steady output, holding off on extensive upgrades.
• CXMT slows expansion to prioritize new products and mature node ramp.
• JHICC gradually grows output and accelerates new process adoption.

Table of Contents

• Index
• DRAM Makers' Capex
• DRAM Makers' Yearly DRAM Revenue
• DRAM Makers' Quarterly Revenue Ranking
• DRAM Makers' Capacity Breakdown by Brand
• DRAM Makers' Capacity Breakdown by Fab
• DRAM Makers' Output by Fab
• DRAM Makers' Output by Brand
• Samsung DRAM Fabs' Capacity/Output by Design Rule
• SK hynix DRAM Fabs' Capacity/Output by Design Rule
• Micron DRAM Fabs' Capacity/Output by Design Rule
• PSMC DRAM Fabs' Capacity/Output by Design Rule
• Nanya DRAM Fabs' Capacity/Output by Design Rule
• Winbond DRAM Fabs' Capacity/Output by Design Rule
• JHICC DRAM Fabs' Capacity/Output by Design Rule
• CXMT DRAM Fabs' Capacity/Output by Design Rule
• Technology Breakdown by Company
• DRAM Makers' Production Output Breakdown by Density
• Density Production Output Breakdown by DRAM Maker
• DRAM Makers' Production Output by Type
• Samsung DRAM Production Output by Type
• SK hynix DRAM Production Output by Type
• Micron DRAM Production Output by Type
• Nanya DRAM Production Output by Type
• PSMC DRAM Production Output by Type
• Winbond DRAM Production Output by Type
• JHICC DRAM Production Output by Type
• CXMT DRAM Production Output by Type
• Spot and Contract Prices Forecast by Quarter

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