3Q26 DRAM Diamond Datasheet
Last Modified
2026-08-19
Update Frequency
Quarterly
Format
EXCEL
TrendForce Offers you a complete analysis on DRAM industry wafer input, production output, technology node…etc. by each company.
Key Highlights
- Overall Supply: Driven by capacity expansion and node migrations, global DRAM bit output maintains strong growth as next-gen fabs come online.
- Top 3 Vendors: Samsung, SK hynix, and Micron are aggressively advancing to sub-20nm nodes, channeling new capacity into high-bandwidth memory and advanced products.
- Taiwanese Makers: Nanya and Winbond expand input via new facilities and node upgrades; PSMC keeps capacity steady, relying on line efficiency.
- Chinese Makers: CXMT and JHICC accelerate fab builds and process transitions to capture robust domestic demand.
Table of Contents
- Index
- DRAM Makers' Capex
- DRAM Makers' Yearly DRAM Revenue
- DRAM Makers' Quarterly Revenue Ranking
- DRAM Makers' Capacity Breakdown by Brand
- DRAM Makers' Capacity Breakdown by Fab
- DRAM Makers' Output by Fab
- DRAM Makers' Output by Brand
- Samsung DRAM Fabs' Capacity/Output by Design Rule
- SK hynix DRAM Fabs' Capacity/Output by Design Rule
- Micron DRAM Fabs' Capacity/Output by Design Rule
- PSMC DRAM Fabs' Capacity/Output by Design Rule
- Nanya DRAM Fabs' Capacity/Output by Design Rule
- Winbond DRAM Fabs' Capacity/Output by Design Rule
- JHICC DRAM Fabs' Capacity/Output by Design Rule
- CXMT DRAM Fabs' Capacity/Output by Design Rule
- Technology Breakdown by Company
- DRAM Makers' Production Output Breakdown by Density
- Density Production Output Breakdown by DRAM Maker
- DRAM Makers' Production Output by Type
- Samsung DRAM Production Output by Type
- SK hynix DRAM Production Output by Type
- Micron DRAM Production Output by Type
- Nanya DRAM Production Output by Type
- PSMC DRAM Production Output by Type
- Winbond DRAM Production Output by Type
- JHICC DRAM Production Output by Type
- CXMT DRAM Production Output by Type
- Spot and Contract Prices Forecast by Quarter
<Total Pages: 29>
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