TrendForce Offers you a complete analysis on DRAM industry wafer input, production output, technology node…etc. by each company.

Key Highlights

• Supply rising while shortages persist; vendors prioritize maximizing output
• Shift to advanced nodes to support high-end and next‑generation products
• Samsung expands advanced capacity and raises advanced‑node mix
• SK hynix leans on domestic fabs for advanced nodes; some capacity serves high‑bandwidth memory
• Micron boosts line efficiency and leads advanced‑node mass production
• Nanya and Winbond increase legacy DDR output to fill gaps
• CXMT focuses on HBM and node transition; JHICC ramps gradually for consumer market
• PSMC stays on mature nodes with stable production

Table of Contents

• Index
• DRAM Makers' Capex
• DRAM Makers' Yearly DRAM Revenue
• DRAM Makers' Quarterly Revenue Ranking
• DRAM Makers' Capacity Breakdown by Brand
• DRAM Makers' Capacity Breakdown by Fab
• DRAM Makers' Output by Fab
• DRAM Makers' Output by Brand
• Samsung DRAM Fabs' Capacity/Output by Design Rule
• SK hynix DRAM Fabs' Capacity/Output by Design Rule
• Micron DRAM Fabs' Capacity/Output by Design Rule
• PSMC DRAM Fabs' Capacity/Output by Design Rule
• Nanya DRAM Fabs' Capacity/Output by Design Rule
• Winbond DRAM Fabs' Capacity/Output by Design Rule
• JHICC DRAM Fabs' Capacity/Output by Design Rule
• CXMT DRAM Fabs' Capacity/Output by Design Rule
• Technology Breakdown by Company
• DRAM Makers' Production Output Breakdown by Density
• Density Production Output Breakdown by DRAM Maker
• DRAM Makers' Production Output by Type
• Samsung DRAM Production Output by Type
• SK hynix DRAM Production Output by Type
• Micron DRAM Production Output by Type
• Nanya DRAM Production Output by Type
• PSMC DRAM Production Output by Type
• Winbond DRAM Production Output by Type
• JHICC DRAM Production Output by Type
• CXMT DRAM Production Output by Type
• Spot and Contract Prices Forecast by Quarter

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