CSP

DRAM Market Bulletin - Jun. 24, 2026 | TrendForce

DRAM Market Bulletin - Jun. 24, 2026

Jun 24, 2026 | PDF

Server DRAM contract prices are seeing upward momentum driven by robust server demand, whereas the spot market remains sluggish due to a lack of consensus between buyers and sellers. Regarding invento...

NAND Flash Market Bulletin - Jun. 24, 2026 | TrendForce

NAND Flash Market Bulletin - Jun. 24, 2026

Jun 24, 2026 | PDF

Due to front-loaded bulk procurement in the first half of the year, consumer electronics will face a weak peak season in the second half, with contract price growth slowing down. The spot market is in...

NVIDIA AI Server Power Roadmap & Data Center Build Risk | TrendForce

NVIDIA AI Server Power Roadmap & Data Center Build Risk

Jun 18, 2026 | PDF

NVIDIA advances its 800V Power Rack roadmap, with mass adoption expected from Rubin Ultra onward, while North American data center buildouts face delays from grid and equipment constraints.

Server Market Bulletin - Jun. 18, 2026 | TrendForce

Server Market Bulletin - Jun. 18, 2026

Jun 18, 2026 | PDF

Global server growth accelerates in 2026 as CSPs expand AI infrastructure investment and custom silicon adoption reshapes procurement strategies.

AI Inference Era: Server CPU Regains Data Center Centrality | TrendForce

AI Inference Era: Server CPU Regains Data Center Centrality

Jun 15, 2026 | PDF

As AI shifts from training to inference and agentic workloads, Server CPU evolves from auxiliary to core orchestrator, lifting both ARM and x86 demand into a new growth cycle.

DRAM Market Bulletin - Jun. 10, 2026 | TrendForce

DRAM Market Bulletin - Jun. 10, 2026

Jun 10, 2026 | PDF

Contract negotiations extend as suppliers prioritize major American clients, while spot prices rise on strong demand. AI adoption reshapes memory specifications toward higher bandwidth and lower power...

Server DRAM Industry Analysis-2Q26 | TrendForce

Server DRAM Industry Analysis-2Q26

Jun 09, 2026 | PDF

AI demand and proprietary chip adoption drive upward revisions in global server shipments. Despite supply bottlenecks, memory face severe shortages and soaring prices. AMD and alternative architecture...

MLCC Market Bulletin - Jun. 8, 2026 | TrendForce

MLCC Market Bulletin - Jun. 8, 2026

Jun 08, 2026 | PDF

Strong AI demand concentrates high-end MLCC specifications while weak consumer electronics shift capacity toward AI servers. CSP custom ASICs trigger frequent design changes, tightening supply and ext...

DRAM Industry Analysis-2Q26 | TrendForce

DRAM Industry Analysis-2Q26

Jun 05, 2026 | PDF

Driven by AI expanding into inference, cloud providers are accelerating data center buildouts, triggering a surge in server memory orders. This has caused contract prices to skyrocket and fueled robus...

1Q26 Revenue Ranking among Server DRAM Suppliers | TrendForce

1Q26 Revenue Ranking among Server DRAM Suppliers

Jun 05, 2026 | PDF

Driven by agentic AI applications, the server DRAM market experienced explosive growth. The need for models to handle complex computations and offload long contexts has led to a severe shortage of key...

Server Market Bulletin - Jun. 4, 2026 | TrendForce

Server Market Bulletin - Jun. 4, 2026

Jun 04, 2026 | PDF

TrendForce raised its 2026 global server shipment forecast, driven by surging AI server demand from CSPs and enterprises, with momentum expected through 2027.

MLCC Price May 2026 | TrendForce

MLCC Price May 2026

May 29, 2026 | PDF

AI demand tightens high-end MLCC supply, prompting agents to raise prices and strengthening supplier bargaining power. Geopolitical risks and inflation raise costs, curbing ODM leverage, with high-end...

1Q26 Revenue Ranking among Enterprise SSD Suppliers | TrendForce

1Q26 Revenue Ranking among Enterprise SSD Suppliers

May 28, 2026 | PDF

The explosion in global AI service demand has triggered a severe supply-demand imbalance in the enterprise SSD market, driving quarterly revenue and contract prices to historic highs. Major suppliers...

ASIC Design and Service Competition Shifts from Chip Scale to Rack/POD Level | TrendForce

ASIC Design and Service Competition Shifts from Chip Scale to Rack/POD Level

May 28, 2026 | PDF

On February 16th 2026, MediaTek CEO Rick Tsai stated in his ISSCC 2026 keynote that the basic unit for measuring AI compute efficiency will no longer be just the AI chip, but the entire AI system, inc...

HBM Market Outlook:HBM Suppliers Seize Pricing Power as AI Demand Fuels Explosive Contract Price Surge | TrendForce

HBM Market Outlook:HBM Suppliers Seize Pricing Power as AI Demand Fuels Explosive Contract Price Surge

May 27, 2026 | PDF

Since 2H25, accelerated AI infrastructure buildouts by CSPs have surged HBM demand and crowded out conventional DRAM capacity, pushing the broader DRAM market into shortage. Constrained by annual pric...

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