Competitive Landscape

NVIDIA’s GB200 Rack Shipments Will Increase After 2Q25; Computex Highlights Applications Related to AI Agents and Expanded Investments in Taiwan That Will Spur Long-Term Development of AI Server Supply Chai

"TrendForce reports that NVIDIA announced plans at Computex 2025 to expand investments and strengthen AI server supply chain cooperation in Taiwan, including building AI supercomputers, expan...

EOL Plans for DDR4 Products Have Led to Price Hikes, and Upward Trend Is Expected to Continue Until 2H25

"TrendForce reports that as memory products evolve, DDR4 modules are nearing end-of-life (EOL), leading to rising prices. Major suppliers like Micron, Samsung, and SK hynix have announced EOL pla...

[Update] MLCC Market Outlook 1Q25~2Q25

1. Overview of Global Macroeconomic Conditions in 1Q25 2. Market Shares of Top 10 MLCC Suppliers in 1Q25 3. Production Capacity and Shipments of Top 10 MLCC Suppliers 4. BB Ratio 5. Inventory Lev...

Contract Prices of NAND Flash Retain Strong Momentum for 3Q25 as AI Demand Triggers Robust Enterprise SSD Growth

"According to TrendForce, the NAND Flash market has maintained equilibrium in early 2025 due to conservative capacity strategies by suppliers. However, sudden US tariffs disrupted this balanc...

TrendForce LED Lighting Market Dynamics Monthly Report－May 2025

Smart Manufacturing Expedites Industrial Transformation

The main theme of Hannover Messe 2025 revolved around industrial digitalization and sustainable development trends. In addition to showcasing cutting-edge technological achievements, the focus was on...

M2. Quarterly Smartphone Panel Shipment_2Q25

Advancement to HBM4 Will Entail Higher Costs with Price Premium Estimated to Exceed 30%

"As demand for AI servers rises, the adoption of HBM4 memory is set to increase costs, with estimated price premiums exceeding 30%. HBM4 features significant changes, including doubling IO ch...

Humanoid Robot Market Bulletin_20250508

Robotics Summit & Expo is a premier event in North America dedicated to the exploration of commercial robotic technology. It took place from late April to early May 2025 in Boston, USA, bringing toget...

Analysis of TSMC’s North America Technology Symposium: Unveiling of Roadmap for Advanced Packaging Solutions and Related Strategy

"TSMC's North America Technology Symposium unveiled a roadmap for advanced packaging solutions, showcasing the 3DFabric® platform, which includes wafer level 3D stacking and advanced packagi...

NVIDIA and AMD Will Face Challenges in China’s AI Server Market Due to New US Export Regulations; Chinese Firms Are Expected to Increase Use of Domestic and In-House AI Chips in 2025

"According to the latest supply chain survey from TrendForce, new US export regulations starting in April 2025 will require licenses for exporting semiconductor chips like NVIDIA H20 and AMD...

Top 10 Global OSAT Companies in 2024—Mature Leaders Stay Strong While New Regional Forces Emerge

"TrendForce's 2024 OSAT report highlights packaging's rising importance due to Moore's Law limits and chip complexity. Asian firms dominate, with Taiwan maintaining...

Top 10 Global OSAT Companies in 2024—Mature Leaders Stay Strong While New Regional Forces Emerge

According to the global market intelligence firm TrendForce, as the limitations of Moore’s Law become more apparent, IC packaging and testing have become critical for the continued...

MLCC Price Apr. 2025

Despite not being directly impacted by the tariff war, MLCC suppliers continue to face significant challenges. Deteriorating economic conditions and international trade tensions have led to a decline...

TrendForce's Analysis Report on the 2025 Global SiC Power Device Market

1. Overview 2. SiC Substrates & Epitaxy 3. SiC Power Devices 4. Automotive SiC 5. SiC Equipment 6. Analysis of Major SiC Players 7. Focus on Chinese SiC Market 8. TrendForce...