Advanced Packaging

Foundry Market Bulletin - Apr. 13, 2026 | TrendForce

Foundry Market Bulletin - Apr. 13, 2026

Apr 13, 2026 | PDF

Taiwanese foundries face structural shifts: TSMC consolidates 12" mature nodes, UMC hikes 8" prices, VIS pivots to PMICs, and PSMC moves to high-value processes amid supply-demand restructuring.

AI Server Industry Analysis-1Q26 | TrendForce

AI Server Industry Analysis-1Q26

Apr 02, 2026 | PDF

Driven by AI and general servers, industry value grows robustly. Despite geopolitical risks and custom chip delays, NVIDIA and AMD's push for premium integrated racks significantly boosts average pric...

Foundry Market Bulletin - Mar. 30, 2026 | TrendForce

Foundry Market Bulletin - Mar. 30, 2026

Mar 30, 2026 | PDF

Samsung accelerates the reduction of mature capacities while hiking prices on fully-loaded advanced nodes. Meanwhile, benefiting from supply shifts and early stocking against rising component costs, C...

2026 Outlook: NVIDIA Rubin Drives New Wave of AI Hardware Upgrades | TrendForce

2026 Outlook: NVIDIA Rubin Drives New Wave of AI Hardware Upgrades

Mar 18, 2026 | PDF

As data centers adopt HVDC architectures to reduce grid-to-chip power losses, demand for advanced power conversion and next-gen semiconductors surges. Meanwhile, Asian manufacturers continue to domina...

Foundry Market Bulletin - Mar. 16, 2026 | TrendForce

Foundry Market Bulletin - Mar. 16, 2026

Mar 16, 2026 | PDF

Driven by strong demand, TSMC accelerates global expansions for advanced nodes and packaging; UMC pushes joint-node sampling despite delays and develops silicon photonics; Vanguard comprehensively rai...

Foundry Market Bulletin - Mar. 2, 2026 | TrendForce

Foundry Market Bulletin - Mar. 2, 2026

Mar 02, 2026 | PDF

Market outlook diverges: Samsung accelerates US expansion despite yield risks. Rising memory costs slow SMIC and Nexchip, while AI orders boost HuaHong. GlobalFoundries significantly increases capex f...

Intel's No SeWaRe Glass Substrates: TGV Challenges and Advanced Packaging Supply Chain Role | TrendForce

Intel's No SeWaRe Glass Substrates: TGV Challenges and Advanced Packaging Supply Chain Role

Feb 24, 2026 | PDF

With Google, Meta, and MediaTek all considering adopting Intel’s EMIB packaging technology, Intel’s technological progress in advanced packaging and glass substrates has once again attracted significa...

Foundry Market Bulletin - Feb. 2, 2026 | TrendForce

Foundry Market Bulletin - Feb. 2, 2026

Feb 02, 2026 | PDF

Samsung rebounds via advanced nodes and US fab restart. SMIC and Nexchip enhance HV tech amid pricing pressure. HuaHong optimizes fab allocation. Smaller foundries slow expansion due to technical hurd...

CPO Testing Revolution: Market Opportunities in Co-Packaged Optics Validation | TrendForce

CPO Testing Revolution: Market Opportunities in Co-Packaged Optics Validation

Jan 28, 2026 | PDF

As Co-Packaged Optics (CPO) moves from the lab toward commercialization, inspection has become the key to achieving mass producibility and long-term system stability. However, CPO inspection still fac...

The AI Interconnect Inflection Point: Ecosystem Shifts and Value Creation in the Physical Layer | TrendForce

The AI Interconnect Inflection Point: Ecosystem Shifts and Value Creation in the Physical Layer

Jan 26, 2026 | PDF

The exponential growth of generative AI is forcing data center infrastructure into an unprecedented architectural overhaul. As system bottlenecks shift away from compute and toward the “I/O wall,” the...

Foundry Market Bulletin - Jan. 19, 2026 | TrendForce

Foundry Market Bulletin - Jan. 19, 2026

Jan 19, 2026 | PDF

AI drives TSMC's expansion and upgraded targets. Vanguard sees rising utilization and prices via power ICs. UMC grows steadily, while PSMC rebounds through memory demand.

Foundry Market Bulletin - Jan. 5, 2026 | TrendForce

Foundry Market Bulletin - Jan. 5, 2026

Jan 05, 2026 | PDF

Samsung to focus on advanced nodes in 2026 with full capacity utilization; SMIC to raise 8-inch and memory foundry prices on strong demand; HuaHong to expand capacity and advance specialty platforms;...

Foundry Market Bulletin - Dec. 22, 2025 | TrendForce

Foundry Market Bulletin - Dec. 22, 2025

Dec 22, 2025 | PDF

TSMC reduces 8-inch capacity to focus on advanced processes; UMC sees rising utilization from AI and future Samsung transfer opportunities. Vanguard acquires TSMC's used equipment to meet str...

Foundry Market Bulletin - Dec. 8, 2025 | TrendForce

Foundry Market Bulletin - Dec. 8, 2025

Dec 08, 2025 | PDF

The foundry sector is undergoing a broad realignment as mature nodes contract, product mixes shift upward, and Chinese demand supports steady growth. Advanced-node expansion continues to face technica...

Foundry Market Bulletin - Nov. 24, 2025 | TrendForce

Foundry Market Bulletin - Nov. 24, 2025

Nov 24, 2025 | PDF

Global foundry markets show steady demand and diverse capacity as leaders push advanced processes and packaging amid geopolitics.

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