In response to the demands of high-performance computing, AI, 5G, and other applications, the shift towards chiplet and the incorporation of HBM memory has become inevitable for advanced chips. As a result, packaging has transitioned from 2D to 2.5D and 3D formats. With chip manufacturing advanci...

August Sees TV Demand Fluctuations Entering August, the TV brand demands echo with noise. Despite 7% Q3 growth, a noticeable dip from last month's projections appears. Yet, panel makers hold steady, adjusting production and raising TV panel prices due to unclear trends for larger sizes. Expect st...

According to Taiwan's Economic Daily, the consumer market is experiencing starkly low demand, causing IC design firms primarily relying on mature processes, such as those in driver ICs, power management ICs, CMOS image sensors (CIS), and microcontrollers (MCUs), to adopt a notably cautious approach ...

At an online investor meeting, Foxconn Group's Chairman Young Liu shared insights on the company's current endeavors. He disclosed that the group is in discussions with over 10 clients on 20 electric vehicle (EV) collaboration projects. Out of these, two projects are already in production, and five ...

According to Taiwan's Commercial Times, TSMC continues to face challenges from ongoing price undercutting and competitive bidding in mature semiconductor manufacturing processes. Concerns arise about the company's ability to offset these challenges with AI-related orders. Reports from the market sug...