TSMC’s advanced packaging capacity remains tight, with CoWoS orders fully booked. According to Economic Daily News, sources say some back-end advanced packaging orders are spilling over to Intel’s Malaysia operations to support shared major customers, breaking with traditional industry practices...

Memory and AI chips aren’t the only hot commodities in semiconductors. The bottleneck is shifting from “not enough chips” to “not enough equipment to make them,” ijiwei reports, adding that with critical component shortages stretching lead times for front-end and memory tools to 12–24 mo...

The People's Government of Fujian Province recently issued the "Development Plan for Emerging and Future Industries During the 15th Five-Year Plan" (hereinafter referred to as the "Plan"). According to the Plan, by 2030, Fujian aims for strategic emerging industrial output to account for approxim...

China’s NAND giant YMTC and its SSD brand ZHITAI have launched a new SSD powered by the company’s latest Xtacking technology. According to IT Home, ZHITAI first launched the Ti600 M.2 SSD in 2023 with Xtacking 3.0 QLC NAND. Three years on, the company has upgraded the lineup with the Ti600s, whi...

Samsung is reportedly preparing another “wide fold” model for next year as demand for the form factor gains traction. According to ETNews, industry sources say the company has initiated two wide-fold development projects for the Galaxy Z9 series and shared the plans with suppliers. Alongside a t...