U.S. NAND leader Sandisk, fresh off launching a Technical Advisory Board to guide its groundbreaking High Bandwidth Flash (HBF) technology in July, has now signed a landmark MoU with South Korean memory giant SK hynix. The partnership aims to jointly define the HBF specifications—poised to revolut...

TSMC, spared from the looming 100% chip tariffs thanks to its massive U.S. investments, rocked the global semiconductor world recently by revealing a leak of its 2nm process. Reports say the company filed complaints with prosecutors, leading to three engineers being detained incommunicado. Notabl...

According to Business Korea, Samsung Electronics is set to manufacture Apple’s next-generation chips at its U.S. facility. In a press release from August 6, Apple announced its partnership with Samsung to co-develop a new chip manufacturing technology, which will debut globally at Samsung’s f...

According to a report by Tom’s Hardware, citing South China Morning Post, Huawei has approved a plan to open-source its CANN software toolkit for Ascend AI GPUs. As noted in the report, the move is intended to strengthen Huawei’s position against NVIDIA and its closed-source CUDA software ecosys...

Amid heated discussions over the alleged leak of TSMC’s 2nm technology, the foundry giant’s internal mechanisms for safeguarding trade secrets and intellectual property are drawing fresh attention. As Liberty Times reports, TSMC has been Taiwan’s top domestic patent applicant for nine consecut...