SK hynix has unveiled a new semiconductor architecture concept centered on High Bandwidth Flash (HBF), a memory technology that stacks multiple NAND flash dies. According to Hankyung, the company recently outlined the concept—dubbed “H3”—in a paper presented at the Institute of Electrical an...

According to TrendForce's latest memory spot price trend report, regarding DRAM, with the Lunar New Year approaching, DRAM spot trading has slowed, as most traders hold off on quotes and purchases. Since spot prices are well above contract levels, TrendForce expects short-term gains to be modest. Me...

Shortly after Intel announced the partnership with SoftBank’s subsidiary SAIMEMORY to develop Z-Angle Memory (ZAM), the product made its first public appearance when SAIMEMORY unveiled it at Intel Connection Japan 2026 on February 3, PC Watch reports. Notably, while the full impact of ZAM versu...

China’s push for chip self-sufficiency is gathering pace. According to South China Morning Post, the Shanghai Integrated Circuit Industry Investment Fund III recently raised its registered capital by 5.5 billion yuan (US$794 million) to 6 billion yuan, representing an increase of more than elevenf...

AI applications continue to drive unprecedented demand for memory, with DRAM supply tightness taking center stage at Winbond’s earnings call yesterday. According to Economic Daily News, Winbond said the DRAM shortage is set to persist, with memory prices this quarter expected to surge 90–95%, an...