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2026-02-18

[News] Japan’s Chip Push in Spotlight: IBM Backs Rapidus as Funding Momentum Builds

As TSMC upgrades its second Kumamoto fab to 3nm, Japan’s homegrown foundry Rapidus is also drawing market attention. Hokkaido Shimbun reports IBM is backing the effort, planning a new office in downtown Chitose this spring to support Rapidus’ next-gen chip ambitions. IBM maintains a close par...

2026-02-17

[News] After Foldables, Are 7-Inch Phones Coming Back? Huawei, vivo Reportedly Eye Bigger Displays

Could 7-inch large-screen smartphones make a comeback? According to Leikeji, sources say two handset makers are currently testing 7-inch large-screen phones. Although it remains unclear whether these devices will ultimately be launched, the move appears to tap into a segment of latent consumer deman...

2026-02-17

[News] SK hynix, Samsung Showcase LPDDR6 at ISSCC as Qualcomm Reportedly Eyes Samsung’s LPDDR6X

While memory titans vie for HBM4 contracts with NVIDIA, another front in the memory race is heating up. According to TechPowerUp, SK hynix and Samsung are preparing to showcase their next-generation LPDDR6 memory at ISSCC 2026 in San Francisco, taking place from February 15–19. The report notes...

2026-02-16

[News] ASML’s High-NA EUV for 2027-28: Which Giants Are Betting Big—Intel, Samsung, SK hynix or TSMC?

As TSMC, Intel, and Samsung kicked off 2nm mass production in late 2025, the spotlight is already shifting to their 1.4nm roadmaps and the rollout of ASML’s next-generation EUV lithography machines. According to Nikkei, citing ASML CEO Christophe Fouquet, Intel, Samsung, and SK hynix are expected ...

2026-02-16

[News] Rising Costs and Demand Drive China’s LLM Price Jump: Zhipu GLM‑5 Hikes 30% in First 2026 Increase

Last Lunar New Year, DeepSeek made headlines worldwide with its V3 model, putting Chinese AI firmly on the global map. This year, as the holiday season approaches, Chinese tech giants are back in the spotlight, igniting a fresh surge in the AI race. Among the moves drawing attention, Zhipu AI ann...

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