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2026-04-17

[News] M&A in Optical Communications Field: Credo to Acquire DustPhotonics

On April 13, high-speed connectivity solution provider Credo Technology Group announced it has entered into a definitive agreement to acquire Israel-based DustPhotonics, a leading developer of Silicon Photonics Photonic Integrated Circuit (SiPho PIC) technology for optical transceivers. Under the...

2026-04-17

[News] Beyond Helium, 8 Material Risks May Hit Korea’s Chip Supply Chain; Israeli Bromine Imports at 97.5%

As geopolitical risks in the Middle East escalate, South Korea is facing rising uncertainties across its energy and raw material supply chains. According to Korea JoongAng Daily, citing a report from the Korea International Trade Association (KITA), the country’s chip sector could face significant...

2026-04-16

[News] TSMC Says CoWoS Offers Industry’s Largest Packaging Amid Intel EMIB Rivalry; CoPoS Advances

TSMC holds its earnings call today, with its response closely watched amid rising industry interest in rival Intel’s advanced packaging technologies, including EMIB. In response, according to TechNews, TSMC Chairman and CEO C.C. Wei states that the company continues to offer the industry’s large...

2026-04-16

[News] TSMC on Terafab: No Shortcuts in Foundry; Confirms Next-Gen LPU Project amid Samsung Rivalry

With Tesla teaming up with Intel on the “Terafab” initiative and accelerating its push into chip manufacturing, attention in the market is turning to how TSMC will respond. At today’s earnings call, chairman C.C. Wei acknowledged that both Intel and Tesla remain TSMC customers, while also call...

2026-04-16

[News] TSMC N3 Tightens on AI Demand; Arizona 2nd Fab 3nm Volume Production in 2H27, Kumamoto in 2028

TSMC holds its earnings call today, with tightness at its 3nm node coming into focus as the foundry giant outlines new plans to expand N3 capacity. Its Chairman and CEO C.C. Wei says that, historically, TSMC does not add capacity once a node reaches its target level; however, in response to strong A...

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