As TSMC has decided to upgrade its 2nd Kumamoto fab to 3nm, the foundry giant is also exploring to secure more opportunities for its mature nodes in Japan. According to its press release on May 8, Sony and TSMC announced the signing of a non-binding memorandum of understanding (MOU) to establish a s...

Baidu’s Kunlunxin, which confidentially filed for a main board listing on the Hong Kong Stock Exchange in January 2026, is reportedly advancing its capital market plans further. According to EE Times China, Kunlunxin launched its STAR Market listing guidance process on May 7, 2026, marking the rol...

Japan’s food seasoning maker Ajinomoto, which has also become a key supplier of chip packaging materials, is accelerating the expansion of its semiconductor-related business. According to a company press release, Ajinomoto, through its consolidated subsidiary Ajinomoto Fine-Techno Co. (AFT), will ...

As demand continues to surge, even three- to five-year supply agreements may no longer be sufficient, prompting big tech firms to explore new ways to gain preferential access to leading memory suppliers. According to Reuters, SK hynix has drawn an extraordinary wave of interest from global tech heav...

As advanced packaging becomes increasingly important, glass substrates are drawing growing industry attention. According to Business Post, SKC and its subsidiary Absolics are expected to begin what could become the world’s first commercial production of glass substrates by the end of this year. ...