[News] Winbond Reportedly Targets 2030 EUV Adoption for 14nm DRAM as Equipment Lead Times Stretch Beyond Two Years

Taiwanese memory chipmaker Winbond, a supplier of specialty DRAM and NOR flash, is advancing its technology roadmap with plans to adopt extreme ultraviolet (EUV) lithography. According to MoneyDJ, Winbond President Pei-Ming Chen said the company plans to develop two generations of 14nm technology, one without EUV and the other incorporating EUV, with the latter targeted for introduction in 2030 if development proceeds smoothly.

Chen said EUV could reduce the multiple patterning steps required as circuit dimensions shrink, potentially shortening processing times and improving yields. Winbond has been collaborating with ASML on EUV technology for approximately three and a half years, sending personnel for training, equipment trial runs, and measurements in preparation for future adoption. ASML has indicated that it could deliver Winbond’s first EUV system in approximately two years, while subsequent systems would take around three and a half years based on current lead times.

Long equipment lead times are also shaping Winbond’s expansion timeline. According to Nikkei, Chen said delivery times for some lithography and metrology tools now exceed two years, requiring the company to place orders well in advance amid competition from larger chipmakers such as TSMC. Construction of its new Kaohsiung fab is set to begin in December, with limited capacity expected in 2029 and a more significant production ramp-up in 2030.

Meanwhile, Chairman Arthur Chiao said capacity expansion initiated in the second half of 2025 is already progressing, with additional output expected in 2027 and further increases in 2028, although growth will slow as cleanroom space reaches its limits, MoneyDJ reports.

Winbond’s Memory Outlook: Strong AI Demand, Consumer Market Risks

Turning to mature memory products, Chen said Winbond’s automotive business has recorded strong growth this year. Automotive memory accounts for approximately 3% to 4% of the global memory market, while demand visibility has improved as major suppliers reduce DDR3, DDR4, and LPDDR4 supply, prompting customers to seek long-term supply agreements, as noted by MoneyDJ.

Looking ahead to the fourth quarter, Chen expects memory prices to continue rising, supporting further revenue growth at Winbond, although at a slower pace than in previous quarters. However, Chairman Arthur Chiao cautioned that further price increases could weigh on consumer demand. According to MoneyDJ, he warned that higher smartphone and PC prices could prompt consumers to delay upgrades, potentially weakening demand.

Chiao noted that AI demand remains strong enough to absorb higher memory prices. Data center installations planned for 2027 and 2028 are largely supported by earlier investment commitments, providing relatively clear visibility into DRAM demand, although supply will depend on how quickly manufacturers expand capacity.

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(Photo credit: Winbond)