[News] MediaTek Reportedly Taps Intel Packaging Veteran After TSMC Hire, Advances Dual CoWoS–EMIB Strategy

MediaTek is strengthening its data center and AI computing business with a senior hire from Intel. According to Liberty Times, former Intel executive Navid Shahriari will join MediaTek as senior vice president on November 9, reporting to the company’s president and chief operating officer. He brings 37 years of experience in semiconductor design engineering and advanced packaging, along with extensive expertise in the data center market.

In his new role, Shahriari will oversee advanced process and yield platforms, design-technology co-optimization, advanced testing and packaging, and quality and reliability. One of his key priorities will be to deepen collaboration with TSMC and other major supply chain partners, integrating advanced technologies to strengthen MediaTek’s AI and high-performance computing offerings, the report notes.

Notably, the appointment follows another senior hire in advanced packaging. According to Reuters, MediaTek brought in former TSMC R&D Vice President Douglas Yu as a part-time advisor in May 2026 to support advanced packaging development and roadmap planning. The two appointments underscore MediaTek’s efforts to strengthen its advanced packaging expertise as it expands into AI data center chips.

Intel Expertise Supports MediaTek’s Advanced Packaging and AI ASIC Push

Shahriari spent most of his career at Intel, where he held senior leadership roles. As noted by ijiwei, he previously served as executive vice president overseeing packaging and testing, foundry technology, and manufacturing operations. During his tenure, he led the development of complex packaging and substrate technologies and supported production across multiple large-scale manufacturing sites worldwide. His responsibilities spanned assembly and packaging, embedded chip packaging, substrates, testing and validation, data center product portfolios, CPU core and GPU/NPU intellectual property, ecosystem enablement, and silicon and packaging technology development.

His appointment comes as MediaTek expands its advanced packaging partnerships. According to ijiwei, MediaTek has reportedly been working with Intel on its Embedded Multi-die Interconnect Bridge (EMIB) technology for certain cloud ASIC projects, including work related to Google’s TPU program. MediaTek is also pursuing advanced packaging options beyond Intel. Reuters reports that the company supports both TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) and Intel’s EMIB technologies, allowing customers to choose between the two approaches.

The broader push comes as MediaTek ramps up its AI accelerator ASIC business. According to Focus Taiwan, the company began shipping its first AI accelerator ASIC in September 2026 and expects the product to generate approximately US$2.5 billion in revenue in the fourth quarter. MediaTek is targeting around US$16 billion in AI ASIC revenue and a 20% market share in 2027, with its next-generation accelerator scheduled to enter commercial production in the first quarter of 2028.

Read more

• [News] MediaTek Confirms Second AI ASIC Customer for 2028 Production; First ASIC Shipments Begin in Sept.
• [News] MediaTek Reportedly Adopts Dual Packaging Strategy With Intel EMIB, TSMC CoWoS for AI ASIC Push

(Photo credit: Intel on YouTube)