[News] Micron Taiwan Investment Tops NT$1.6T as Four-Site Expansion Accelerates; Nanya Adds Pingtung Project

Micron and Nanya Technology are stepping up investments in Taiwan as memory makers expand advanced DRAM and AI-related capacity. According to Economic Daily News, Micron Taiwan chairman Donghui Lu said the company is bringing its most advanced memory processes to Taiwan, with its second HBM advanced packaging facility in Taichung set to begin operations in October 2026 and further expansion underway in Tongluo, Taoyuan, and Tainan.

Meanwhile, Central News Agency reports that Taiwan’s National Science and Technology Council (NSTC) approved Nanya Technology’s plan to establish operations at the Pingtung Science Park, where the company plans to develop advanced 3D wafer packaging and testing using through-silicon via (TSV) and wafer-stacking technologies.

Nanya Technology has not disclosed the size of its Pingtung investment, though industry sources estimate that a new fab would require at least NT$100 billion, Economic Daily News notes. Micron, meanwhile, had invested more than NT$1.6 trillion in Taiwan as of June, with tens of billions more expected. Together with Winbond’s expansion in Kaohsiung, additional investments by the three memory makers are expected to approach NT$200 billion, as the report highlights.

Micron Expands Advanced DRAM and HBM Footprint in Taiwan

Among the three memory makers, Micron is pursuing a particularly broad expansion spanning front-end manufacturing and advanced packaging. According to Economic Daily News, its investment in Taiwan over the past four years has already matched the total from the previous roughly 25 years. Micron is also bringing its latest DRAM technologies to Taiwan, including its 1γ process, the company’s first to use EUV lithography, the report notes.

In Taichung, Micron’s largest manufacturing base in Taiwan, the company is expanding HBM back-end production. With existing advanced packaging space running short, Micron began converting a conventional facility into a second advanced packaging plant in 2025. Commercial Times adds that the facility, expected to come online in mid-October 2026, will primarily support HBM capacity expansion.

In Tongluo, Micron is expanding front-end capacity at the P5 fab acquired from PSMC earlier this year. More than 100 pieces of equipment have already moved in, while work on a second facility has begun, according to Economic Daily News. Central News Agency adds that Micron aims to begin the first phase of production at its expanding Tongluo site in the second half of 2027.

In Taoyuan, Fab 11E is being built for EUV equipment, with future High-NA EUV systems also factored into its design. The advanced-process facility is expected to come online around 2028, Economic Daily News notes.

In Tainan, Micron is accelerating equipment installation at a former AUO display panel facility that is being converted into a semiconductor site. Lu said an 11-meter-high warehouse has already been transformed into a three-story cleanroom, with equipment moving in since early September 2026. The site will primarily focus on front-end wafer testing, the Economic Daily News report notes.

Read more

• [News] Micron FY2026 Revenue Surges 256% to $133.2B, Locks In 35%+ of Revenue Through 2030
• [News] Nanya Tech Reportedly Eyes Yunlin, Pingtung Fabs for 1d DRAM, Custom Memory, Investment to Top NT$300B

(Photo credit: Micron Taiwan)