[News] China State-owned Enterprise Restructuring Fund Makes Strategic Investment in Hyper Photonix
On September 22, Chengtong Fund announced that its managed China State-owned Enterprise Restructuring Fund (a sub-fund under the National Integrated Circuit Industry Investment Fund, also known as the “Big Fund”) has completed a strategic investment in Hyper Photonix Technology (Hangzhou) Co., Ltd, which is expected to accelerate the commercial deployment and mass production of high-speed silicon photonics chips and optical transceiver modules.
Founded in 2019, Hyper Photonix is an optical communications enterprise built around proprietary silicon photonics technology. The company specializes in providing high-speed optical interconnect solutions for data centers and AI clusters, covering silicon photonic integrated circuits (PICs), high-speed optical engines, optical transceivers, and DSPs, while driving supply chain integration via its self-developed tech platforms.
According to company disclosures, Hyper Photonix has established a fully integrated in-house process spanning optical chip design, packaging, module design, and manufacturing. It operates a high-speed optical transceiver production facility in Bengbu, Anhui Province.
Established in 2022 and spanning approximately 12,000 square meters, the facility has achieved mass production and volume shipping of 400G DR4 and 800G DR8 silicon photonics optical modules, with a monthly capacity reaching 100,000 units.
Earlier this year, the company demonstrated its 1.6T silicon photonics modules and 200G/lane technologies, while pushing forward next-generation optical interconnect solutions, including multi-core fiber (MCF) technologies.
Its current silicon photonics portfolio spans 400G, 800G, and 1.6T architectures. Currently, its 800G/1.6T silicon photonics chips and modules possess mass-production capabilities, and its proprietary silicon photonic modulator chips can address mainstream optical transceiver requirements ranging from 400G to 1.6T.
As AI compute clusters expand and intra-datacenter bandwidth demands surge, optical module transmission speeds are rapidly upgrading toward 800G, 1.6T, and beyond, driving the accelerated market penetration of silicon photonics and Co-Packaged Optics (CPO) technologies.
Amid these market dynamics, industrial investment in silicon photonics has increasingly covered the full supply chain—from chips and discrete devices to high-speed transceivers and advanced manufacturing.
The strategic investment from China State-owned Enterprise Restructuring Fund into Hyper Photonix, a player capable of mass-producing 800G/1.6T solutions, signals a clear acceleration in the transition of high-speed silicon photonics from technical R&D to commercial, large-scale manufacturing.
(Photo credit: Hyper Photonix)