[News] Wuhan Xinrongguang Founded with Registered Capital of CNY 13.2 Billion, Targeting Silicon Photonics

According to corporate database Qichacha, Wuhan Xinrongguang Technology Co., Ltd. (hereinafter “Wuhan Xinrongguang”) was registered on September 2 in the Wuhan East Lake High-tech Development Zone with a registered capital of CNY 13.2 billion. Sun Peng serves as the legal representative.

The company’s scope of business spans integrated circuit (IC) design, IC chip design and services, IC chip and product manufacturing, electronic component manufacturing, power electronic component manufacturing, as well as technology import and export.

Equity structure data reveals that Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. (hereinafter “XMC”) is the largest shareholder, contributing CNY 4 billion for a 30.3% stake. Additional investors include Wuhan Optics Valley Semiconductor Industry Investment Co., Ltd., China Internet Investment Fund (Limited Partnership), China Fortune-Tech Capital (CFTC), Hua Capital, Shenzhen Capital Group Co., Ltd. (SCGC), and Shangqi Capital.

As the largest shareholder of Wuhan Xinrongguang, XMC was originally a specialty process wafer foundry platform under YMTC. In June, YMTC transferred its 39% stake in XMC to Optics Valley State-Owned Assets Management.

XMC has made silicon photonics a core growth vector in recent years. On August 28, the company unveiled its “Core-Optics Initiative,” establishing a ten-year strategic roadmap focused on optical sensing/interconnects and 3D memory-compute integration. Key technological priorities include 3D Link, optoelectronic integration, and silicon-on-insulator (SOI) technologies, with plans to quadruple overall production capacity over the next decade.

Currently, XMC has established a 12-inch silicon photonics volume manufacturing platform alongside 12-inch RF-SOI process capabilities. These solutions primarily target AI, high-performance computing (HPC), optical communications, and optical computing markets.

In addition to silicon photonics, XMC is actively scaling its 3D integration process portfolio. The company currently maintains mass production capabilities for Through-Silicon Via (TSV) and hybrid bonding, with dual-wafer stacking, multi-wafer stacking, and 2.5D silicon interposers all transitioning into volume production.

(Photo credit: FREEPIK)