Monthly Archives: January 2026

[News] LG Reportedly Delays Glass Substrate Commercialization to 2030 on Demand Uncertainty

Multiple industry players have been working to advance glass substrates, with LG among them, though the Korean company is reportedly recalibrating its timeline. According to ZDNet, LG had previously anticipated large-scale commercialization around 2028 but has since pushed its outlook …

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[News] China’s Domestic Chip Equipment Adoption Beats 2025 Target at 35%, Led by NAURA, AMEC

China’s domestic chip equipment push is gaining momentum. According to Commercial Times, citing Jiemian News, data released in January by the China Semiconductor Industry Association show that the share of domestically manufactured semiconductor equipment used in China rose from 25% …

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[News] Micron Reportedly Sees Memory Crunch Through 2028; OEMs Keep Consumer Reach Despite Crucial Exit

As Micron prepares to break ground on its New York Mega fab on January 16, the company’s outlook on the global memory market remains under close watch. Wccftech, citing Micron’s VP of Marketing for the Mobile and Client Business Unit, …

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[News] TSMC May Reallocate Select 45–90nm Mature-Node Capacity to CoWoS-Related Production

As AI, HPC, and heterogeneous integration architectures gain rapid adoption, TSMC is accelerating adjustments to its manufacturing plans. According to Commercial Times, industry sources say TSMC is evaluating a reallocation of part of its 40nm–90nm mature-node capacity, which could be …

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[News] Memory OSAT Prices Reportedly Jump 30%, Led by Powertech, Micron’s Key Supplier

While upstream memory makers continue to lift prices as supply tightens and demand surges, the impact is now cascading into the testing and packaging segment. According to the Economic Daily News, major Taiwanese memory OSAT providers — led by Micron’s …

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