Daily Archives: 2026-04-01

[News] Silicon Photonics Race Intensifies as TSMC Targets 2026 COUPE Production, Samsung Eyes 2029 CPO Turnkey

Posted on 2026-04-01 by TrendForce

Please note that this article cites information from Commercial Times, The Elec and TSMC. As GPU designs evolve toward denser chip-to-chip connectivity and faster data rates, optical transmission is taking on a bigger role. Foundry giants are also moving in, with …

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[News] JEDEC Reportedly Plans to Relax HBM Height Specs to ~900µm, Potentially Slowing Hybrid Bonding Adoption

Posted on 2026-04-01 by TrendForce

Please note that this article cites information from Chosun Ilbo, Newsis, News Tomato, and The Elec. JEDEC is reportedly considering relaxing standards governing next-generation HBM. According to Chosun Ilbo, sources indicate that JEDEC (Joint Electron Device Engineering Council) is weighing a plan to raise …

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[News] “Father of HBM” Predicts Memory-Centric AI Shift as HBF Emerges, Reshaping GPUs’ Role

Posted on 2026-04-01 by TrendForce

Please note that this article cites information from Aju News, Money Today Broadcasting, Hankyung and SK hynix. As memory giants race to bet on post-HBM technologies like HBF (High Bandwidth Flash), the man who is widely credited as the “father of …

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