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Recent Posts
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- [News] Out with the Old: Memory Giants Map Their 2025-26 Exit Strategy amid Supply Crunch
- [News] Expert Says HBF May Be Deployed in NVIDIA GPUs by 2027–28; Market Could Surpass HBM by 2038
- [News] SK hynix Unveils 5-Bit NAND That Splits Cells, Delivers 20× Faster Reads
- [News] MediaTek Debuts Dimensity 9500s on TSMC 3nm and 4nm 8500, Targeting Upper-Midrange Market
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Monthly Archives: November 2025
[News] Samsung Brings Back Dual-CEO System, Strengthens DX and SAIT Leadership for the AI Era
Samsung has unveiled its “2026 regular executive reshuffle,” announcing four senior personnel changes. According to ZDNet, the company has restored a dual-CEO structure through this president-level reorganization. Roh Tae-moon will now serve as co-CEO alongside Vice Chairman Jun Young-hyun, who …
[News] US Lawmakers Could Eye 10-Year Ban on CHIPS Act Grants Buying Chinese Chip Tools, with Waivers
While U.S. officials have reportedly signaled that long-anticipated semiconductor tariffs may not be imposed anytime soon, the country is maintaining strict controls on China’s chip industry. As part of these ongoing efforts, Reuters reports a bipartisan group of U.S. lawmakers …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged Applied Materials, DUV, EUV
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[News] OLED Industry Landscape Reshapes as Chinese Companies Ramp up Investment in Expanding Production
China’s display industry is witnessing a new wave of large-scale OLED investment, with domestic panel makers pouring capital into next-generation production lines. Following TCL CSOT’s official launch of its 8.6-generation ink-jet-printed OLED line at the end of October, market data …
[News] Samsung May Unveil Executive Shake-Up Within Days; Memory Leadership Under Scrutiny
Samsung may be approaching a round of executive reshuffling. According to Chosun Daily, sources say the company began issuing retirement notices to some executives on the 20th. With these notifications underway, subsequent appointments could be announced as early as the …