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Recent Posts
- [News] China’s OSATs Step Up: Tongfu Microelectronics to Raise RMB 4.4B; JCET Backs Chip Fund
- [News] Out with the Old: Memory Giants Map Their 2025-26 Exit Strategy amid Supply Crunch
- [News] Expert Says HBF May Be Deployed in NVIDIA GPUs by 2027–28; Market Could Surpass HBM by 2038
- [News] SK hynix Unveils 5-Bit NAND That Splits Cells, Delivers 20× Faster Reads
- [News] MediaTek Debuts Dimensity 9500s on TSMC 3nm and 4nm 8500, Targeting Upper-Midrange Market
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Monthly Archives: September 2025
[News] Researchers Propose “Beyond EUV” Using Soft X-Rays, Potentially Challenging High-NA EUV
According to Tom’s Hardware, citing Cosmos, Johns Hopkins University researchers have proposed “beyond-EUV (B-EUV),” a step beyond today’s industry-standard EUV lithography. The method employs 6.5–6.7nm soft X-ray lasers, which the report notes could enable resolutions down to 5nm and below. …
[News] China’s Rare-Earth Shipments Hit Record in Aug. Before Xi-Trump Talks Amid Ongoing Access Risks
Ahead of a scheduled call between U.S. President Donald Trump and Chinese President Xi Jinping on TikTok and trade issues, China’s rare-earth exports surged to a record 7,338 tons in August, Bloomberg reports, citing customs data. As per Bloomberg, the …
[News] STMicroelectronics Joins Panel-Level Packaging Race with New French Pilot Line, Launching 3Q 2026
As leading foundries and packaging giants such as TSMC and ASE ramp up panel-level packaging (PLP) capacity, STMicroelectronics has emerged as an unexpected contender. The company announced it will establish a new pilot line at its Tours site in France …
[News] DDR4, DDR5 October Prices to See Double-Digit Gains; Taiwan’s DRAM Makers Poised to Benefit
According to Commercial Times, the global memory market continues to see price increases, driven by urgent orders from generative AI and major cloud service providers (CSPs). Industry sources note that both DDR4 and DDR5 contract and spot prices are set …
[News] Samsung Reportedly Secures Foundry Deal for IBM Power11 Using 7LPP EUV Process
According to Chosun Biz, sources say Samsung has secured a foundry contract with IBM, one of the top five players in the data center CPU market, to produce its next-generation Power11 chip. The chip will be manufactured on Samsung’s refined …