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- [News] Out with the Old: Memory Giants Map Their 2025-26 Exit Strategy amid Supply Crunch
- [News] Expert Says HBF May Be Deployed in NVIDIA GPUs by 2027–28; Market Could Surpass HBM by 2038
- [News] SK hynix Unveils 5-Bit NAND That Splits Cells, Delivers 20× Faster Reads
- [News] MediaTek Debuts Dimensity 9500s on TSMC 3nm and 4nm 8500, Targeting Upper-Midrange Market
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Monthly Archives: September 2025
[News] Resonac Teams up with Applied Materials, TEL and Other Chip Giants on Panel-level Interposers
As fan-out panel-level packaging (FOPLP) gains traction among semiconductor leaders like TSMC, Japanese companies—long known for their materials expertise—are stepping into the spotlight as well. Resonac, according to Nikkei and its press release, has announced JOINT3, a joint development framework …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged Applied Materials, FOPLP, Resonac, Tokyo Electron
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[News] Google Reportedly Courts Smaller CSPs to Host TPUs, Taking Aim at NVIDIA
According to The Information, citing sources, Google has recently approached smaller cloud providers that primarily lease NVIDIA chips, urging them to also host its AI processors in their data centers. As the report notes, the goal may be to encourage …
Posted in Artificial Intelligence, Emerging Technologies
Tagged Alphabet, Google, Nvidia, TPU
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[Sponsor Content] iDEAL Semiconductor Announces 200 V Family of SuperQ-based MOSFETs With Industry-Leading Cost x Performance
iDEAL Semiconductor has announced the first of its 200 V family of SuperQ™-based MOSFETs has entered mass production, with four additional 200 V devices now sampling. SuperQ is the first major advance in silicon MOSFET technology in more than 25 …
[News] Samsung Reportedly Plans Exynos 2600 in Galaxy S26 Models, Reducing Qualcomm Reliance
According to South Korea’s Maeil Business Newspaper, sources say Samsung plans to equip the base and slim Galaxy S26 models with the Exynos 2600, while the Ultra version will feature Qualcomm’s Snapdragon 8 Elite Gen 2. Samsung’s Exynos is reportedly …
Posted in IC Design, IC Manufacturing, Package&Test, Semiconductors
Tagged exynos 2600, Qualcomm, Samsung
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[News] China’s Chip Industry Surges in 1H25 — 38 A-Share Listed Firms Reportedly Post Growth
According to Shanghai Securities News, China’s chip industry is reportedly seeing growth driven by AI. The report notes that among 102 A-share listed companies engaged in digital chip design, analog chip design, integrated circuit manufacturing, and IC packaging and testing, …
Posted in IC Design, IC Manufacturing, Package&Test, Semiconductors
Tagged Cambricon, China, Hua Hong, hygon, JCET, SMIC
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