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- [News] Out with the Old: Memory Giants Map Their 2025-26 Exit Strategy amid Supply Crunch
- [News] Expert Says HBF May Be Deployed in NVIDIA GPUs by 2027–28; Market Could Surpass HBM by 2038
- [News] SK hynix Unveils 5-Bit NAND That Splits Cells, Delivers 20× Faster Reads
- [News] MediaTek Debuts Dimensity 9500s on TSMC 3nm and 4nm 8500, Targeting Upper-Midrange Market
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Monthly Archives: February 2025
[News] Micron Races Ahead in 10nm-class DRAM with 1γ DDR5 Samples Delivered to Intel & AMD
As memory giants ramp up their efforts on 10nm-class DRAM, Micron seems to be gaining an advantage, as it announces the shipment of 1γ (1-gamma) DRAM. According to its press release, the company has delivered 1γ (gamma) DDR5 samples to …
[News] STMicroelectronics and Onsemi Struggle Amid Market Downturn, Cutting Thousands of Jobs
Power chipmakers are grappling with the downturn in the automotive chip market. According to a Bloomberg report, STMicroelectronics NV CEO Jean-Marc Chéry is facing pressure from the Italian government to step down, citing poor performance as the primary reason. The …
[News] Samsung Reportedly Targets 1,000-Layer NAND by 2030, Rolls Out Wafer Bonding at 400 Layers
As the NAND race heats up, Samsung has revealed its roadmap, aiming to develop 1,000-layer NAND by 2030, according to the bell. To achieve the goal, the memory giant plans to introduce a “multi-BV” NAND structure, stacking four wafers to …
[News] Samsung Develops Groundbreaking Achromatic Metalens with POSTECH
Samsung Electronics today announced that it has published a joint research paper with Pohang University of Science and Technology (POSTECH) detailing the development of an innovative achromatic metalens in the renowned academic journal Nature Materials. The paper, titled “Roll-to-plate printable …
Posted in Optical Semiconductors
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