Weighed down by weak consumer demand and elevated wafer costs, NAND Flash wafer contract prices ended their upward run this month, holding flat across MLC, TLC, and QLC as module makers’ purchasing in...
Client SSD contract prices continue to rise this quarter, though gains have narrowed markedly. With weak PC end demand, rising system BOM costs, and inventory still to be digested, buyers are firmly r...
Weak end demand is weighing on smartphone and PC contract negotiations, with buyers and sellers still at a standoff. Driven by AI demand, enterprise SSD is poised to be the first to settle quarterly p...
As the three major suppliers phase out mature process nodes, DDR4 supply is set to tighten notably, pushing up consumer DRAM contract prices. In the spot market, weak demand and typhoon disruptions ha...
This includes a comprehensive market update on Global and China region, extending the market landscape and market size further into specific region along with the long-term forecast.
This provides a comprehensive Global IC & Semi market analysis, including various application and product types, as well as a forecast on the situation of IC &a...
AI chipmakers are adopting custom HBM as base dies move to advanced logic nodes, strengthening TSMC's role in the HBM supply chain.
In 4Q26, buyer pushback at peak costs, high inventory and Chinese vendors’ rising share curb TLC eMMC/UFS gains, while MLC eMMC dips on substitution; 1Q27 off-season prices plateau as MLC faces heavie...
Hybrid Bonding is set to become a long-term DRAM trend, driven by scaling and bandwidth requirement, though timing depends on yield and cost.
Fourth-quarter contract price hikes are set to narrow as spot prices stay range-bound, while hybrid bonding replaces layer stacking as the key to NAND speed and cost.
HBM shortages push AI chipmakers to cut stack heights, making 8hi mainstream from 2H27 while 12hi share declines.
With our expertise in the memory market, this provides a comprehensive analysis and forecast on HBM market share, ASP, wafer capacity, demand consumption, etc.
TrendForce has raised the capex forecast for major US and Chinese CSPs. With memory contract prices remaining elevated, memory spending is set to exceed half of total capex, while suppliers are priori...
TrendForce offers you a complete analysis on DRAM industry supply/demand sufficiency, cost analysis and price forecast.
Agentic AI and inference reshape workloads, lifting server CPU demand. Shipments surge as CSP in-house Arm CPUs erode x86 share.
