2026 Global HBM: HBM3e Price Drop

Last Modified

2025-09-22

Update Frequency

Aperiodically

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PDF

Analyst summary: Samsung completed NVIDIA certification for HBM3e and began limited shipments; HBM3e will be the near‑term mainstream. Supplier competition is intensifying while HBM4 upgrades are expected to raise costs and premiums; certification timing will shape prices.

Key Highlights

Samsung completed HBM3e certification with a major customer and started limited shipments.
Process adjustments and re-sampling were made to meet packaging and system requirements.
HBM3e faces intense price and share competition as suppliers seek to fill capacity.
HBM4 technology upgrades are expected to raise manufacturing costs and create premium pressure.
Supplier count and certification timing will determine future supply and pricing dynamics.

Introduction
HBM3e 12hi Remains as Market Mainstream for Demand in 2026; Samsung's Penetration of NVIDIA's Supply Chain Proves to be Better Late than Never
Trend Is Set for Intensifying Competition for Market Share and Price War in HBM3e Segment; HBM4 Will Be the Next Battleground
- Blended ASP of HBM Products
Crowding-Out Effect of HBM3e Production on the Supply of DDR5 and LPDDR5(X) Products Could Become More Pronounced

Blended ASP of HBM Products