Glass substrates are emerging as a highly promising solution in advanced semiconductor packaging with recent breakthroughs in Through-Glass Via (TGV) technology. They are poised to drive innovation in...
UMC focuses on mature processes in China with limited expansion; main growth is in Singapore fab, while Vanguard accelerates capacity in the new Singapore fab, surpassing industry growth.
AI chip boom drives CoWoS expansion, straining raw material supply for ABF and BT substrates, delaying NAND Flash output.
"TSMC's North America Technology Symposium unveiled a roadmap for advanced packaging solutions, showcasing the 3DFabric® platform, which includes wafer level 3D stacking and advanced packagi...
For decades, the semiconductor industry has thrived by adhering to Moore’ Law, achieving rapid development through the continuous miniaturization of transistors...
"TrendForce reports NVIDIA announced next-gen B300, Rubin, and Vera at GTC 2025, emphasizing memory, liquid-cooling, and CPO network advancements, shifting from GB NVL72 to VR NVL144 and Rubin Ul...
"TrendForce reports TSMC's recent CoWoS capacity adjustment is due to prior customer overbooking, but CSP demand remains largely unchanged. 2025 CoWoS total demand is...
According to the latest supply chain survey by TrendForce, recent adjustments in TSMC’s CoWoS production capacity can be assessed from both supply and demand perspectives...
1. Foundry Market Overview 2. Impact of Capacity Supply and Geopolitical Factors 3. AI-Driven Growth in the Foundry Industry 4. TRI’s View
TrendForce indicates that TSMC is expanding its US investment to US$165 billion, establishing six advanced process fabs, two advanced packaging plants, and an R&D center in Arizona. Geopolitical t...
Global market intelligence firm TrendForce reports that TSMC announced on March 4th its intention to increase its investment in advanced semiconductor manufacturing in the United States...
TrendForce reports that the total revenue of the global top 10 foundries climbed 9.9% QoQ to a new record in 4Q24, driven by strong wafer shipments from advanced nodes (3nm and 5/4nm). TSMC maintained...
Global market intelligence firm TrendForce reports that the global foundry industry displayed diverging trends in 4Q24...
President Trump, after taking office, initiated a tariff war with China, Canada, and Mexico immediately, fulfilling the commitment he made in November 2024. This report will update the latest developm...
TrendForce indicates that the US export control updates on January 16th extend KYC review standards to packaging technologies and expand controls to logic ICs at 16/14nm and below, 3D NAND with 128+ l...
