Technology Roadmap

From 2.5D to 3D: Key Processes of Hybrid Bonding and Strategies of Equipment Providers | TrendForce

From 2.5D to 3D: Key Processes of Hybrid Bonding and Strategies of Equipment Providers

Jun 05, 2024 | PDF

Under the influence of growing AI-related demand and the slowing pace of node migration under Moore’s Law, achieving lower power consumption and higher transistor counts on a single chip has become a...

NAND Flash Industry Analysis-2Q24 | TrendForce

NAND Flash Industry Analysis-2Q24

Jun 04, 2024 | PDF

Strong demand for enterprise SSDs: Thanks to the demand related to AI-enabled applications, the attach rate of SSDs among servers rose in 1Q24...

NAND Flash Market Bulletin_20240529 | TrendForce

NAND Flash Market Bulletin_20240529

May 29, 2024 | PDF

Having arrive at the end of May, the consumer market remains conservative towards future demand, while suppliers are expected to carry on with their intention in raising prices throughout 3Q24...

Foundry Market Bulletin_20240527 | TrendForce

Foundry Market Bulletin_20240527

May 27, 2024 | PDF

Samsung Foundry generated US$3.36 billion of revenue in 1Q24 at an approximate QoQ drop of 7.1%, and remained low in capacity utilization primarily due to clients’ off-season stocking activities...

NAND Flash Market Bulletin_20240522 | TrendForce

NAND Flash Market Bulletin_20240522

May 22, 2024 | PDF

It has not been easy for wafers to ascend in prices this month as consumer product brands are maintaining their conservativeness towards 2H24 demand...

NAND Flash Market Bulletin_20240515 | TrendForce

NAND Flash Market Bulletin_20240515

May 15, 2024 | PDF

The client end is forced to accept the increase of 2Q24 contract prices, despite poor demand from the consumer market...

Era of Liquid Cooling Has Arrived Ahead of Schedule Thanks to Increasing Computing Power and Efforts to Save Energy and Cut Emissions | TrendForce

Era of Liquid Cooling Has Arrived Ahead of Schedule Thanks to Increasing Computing Power and Efforts to Save Energy and Cut Emissions

May 14, 2024 | PDF

As the overall performance of cloud computing resources becomes more powerful, the energy consumption and heat generated by servers are also on the rise. Data center operators now urgently seek more e...

Foundry Market Bulletin_20240513 | TrendForce

Foundry Market Bulletin_20240513

May 13, 2024 | PDF

TSMC pointed out from its earnings call on April 18th that it has officially lowered the projection on the overall foundry industry from a YoY growth of 20% to a mid-to-high-teens% due to the slow rec...

A Glimpse into the Adoption Challenges and Technological Planning of TSMC’s 3nm Technology from the TSMC Techonology Synposium | TrendForce

A Glimpse into the Adoption Challenges and Technological Planning of TSMC’s 3nm Technology from the TSMC Techonology Synposium

May 10, 2024 | PDF

TSMC president C.C. Wei was questioned by analysts about the potential introduction of High-NA EUV during TSMC’s 4Q23 earnings call. He responded, “Because of technology itself is no value. Only when...

NAND Flash Market Bulletin_20240508 | TrendForce

NAND Flash Market Bulletin_20240508

May 08, 2024 | PDF

Enterprise and PC SSD have come to an increase of more than 20% in average contract prices for 2Q24 after a month of negotiations on various end products...

Global Trends in Cloud AI Chip Industry  (Presentation) | TrendForce

Global Trends in Cloud AI Chip Industry (Presentation)

May 08, 2024 | PDF

1. Status-quo of the Cloud AI Chip Market 2. Developments of Cloud AI Chipmakers Worldwide 3. Developments of CSPs’ Self-designed AI Chips 4. TRI’s View

Analysis on Development Dynamics of Global FPGA Market | TrendForce

Analysis on Development Dynamics of Global FPGA Market

May 03, 2024 | PDF

FPGAs have diverse functions and are widely used in various fields, and is increasing in importance with the continuous advancement of electronic devices. This report mainly analyzes the product chara...

Foundry Market Bulletin_20240429 | TrendForce

Foundry Market Bulletin_20240429

Apr 29, 2024 | PDF

US Department of Commerce announced on April 15th that Samsung’s US fab has been awarded with a direct funding of US$6.4 billion, which accounts for approximately 14.2% of the particular project...

NAND Flash Market Bulletin_20240424 | TrendForce

NAND Flash Market Bulletin_20240424

Apr 24, 2024 | PDF

Suppliers are pretty much settled on their intention in carrying on with the increase of prices, despite ongoing negotiations on 2Q24 contract prices between market participants...

Dynamic of Taiwan's Cloud AI IC Design Industry (Presentation) | TrendForce

Dynamic of Taiwan's Cloud AI IC Design Industry (Presentation)

Apr 19, 2024 | PDF

1. Market Status of Cloud AI Chips 2. AI ASIC Suppliers 3. IC Design Service Providers 4. Memory IP Providers 5. TRI’s View

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