Technology Roadmap

SK hynix Introduces HBM3e 16hi, Boosting Maximum Bit Capacity to 384GB | TrendForce

SK hynix Introduces HBM3e 16hi, Boosting Maximum Bit Capacity to 384GB

Nov 11, 2024 | PDF

TrendForce indicates that SK hynix has launched the industry's first HBM3e 16hi product, boosting maximum bit capacity to 384GB. This move aims to address the demand for higher-capacity HBM....

Promising Future for Humanoid Robots Spurs Growth in Reducer Industry | TrendForce

Promising Future for Humanoid Robots Spurs Growth in Reducer Industry

Nov 11, 2024 | PDF

The trends and application scenarios for humanoid robots are becoming increasingly clear, presenting significant business opportunities for the reducer industry. Harmonic Drive Systems, Nabtesco, Neug...

Semi-Solid and Solid-State Batteries: Dual Engines Driving the Next Battery Revolution | TrendForce

Semi-Solid and Solid-State Batteries: Dual Engines Driving the Next Battery Revolution

Nov 07, 2024 | PDF

Despite maintaining positive growth, BEV momentum has weakened due to persistent range anxiety. Given the general consensus that the current liquid li-ion batteries have reached their energy density l...

NAND Flash Market Bulletin_20241106 | TrendForce

NAND Flash Market Bulletin_20241106

Nov 06, 2024 | PDF

Revisions for purchase orders of consumer products are ongoing, where end clients, due to the weak momentum in the supposedly peak season...

Impending Launch of NVIDIA’s Blackwell and B300 Series Will Drive Shipments from Liquid Cooling Supply Chain; GB200 NVL72 Will Adopt Liquid-to-Air (L2A) Cooling Solution by 2025 | TrendForce

Impending Launch of NVIDIA’s Blackwell and B300 Series Will Drive Shipments from Liquid Cooling Supply Chain; GB200 NVL72 Will Adopt Liquid-to-Air (L2A) Cooling Solution by 2025

Oct 30, 2024 | PDF

TrendForce forecasts that shipments of liquid cooling solutions will surge with the launch of NVIDIA's Blackwell and B300 series AI servers. The GB200 NVL72 is expected to adopt a liquid-to-a...

NAND Flash Market Bulletin_20241030 | TrendForce

NAND Flash Market Bulletin_20241030

Oct 30, 2024 | PDF

3Q24 was seen with smartphone brands actively ridding their inventory, followed by a reduction in order pulls from the PC market amidst weakening demand...

A New Era of IC Packaging: The Crucial Role and Market Outlook of ABF | TrendForce

A New Era of IC Packaging: The Crucial Role and Market Outlook of ABF

Oct 30, 2024 | PDF

The report provides an in-depth exploration of the applications and growing demand for ABF substrates in AI servers, autonomous vehicles, and high-performance computing (HPC). Furthermore, it provides...

Foundry Market Bulletin_20241028 | TrendForce

Foundry Market Bulletin_20241028

Oct 28, 2024 | PDF

Samsung Foundry’s 12-inch CIS is mainly supplied to Samsung System LSI, and has planned for a corresponding capacity at 65/45nm (ISP at 28nm) based on System...

NAND Flash Market Bulletin_20241023 | TrendForce

NAND Flash Market Bulletin_20241023

Oct 23, 2024 | PDF

As of mid-October, neither the traditional peak season (3Q24) that just concluded, nor China’s National Day holiday, were able to significantly revitalize the demand of the consumer market...

Overview on China’s Development in Industrial Robots through New Quality Productive Forces | TrendForce

Overview on China’s Development in Industrial Robots through New Quality Productive Forces

Oct 23, 2024 | PDF

Made-in-China is accelerating its transition towards automation to address labor shortages amidst rising labor costs, low birth rates, and an aging population. At the same time, there is a push for ma...

Foundry Market Bulletin_20241014 | TrendForce

Foundry Market Bulletin_20241014

Oct 14, 2024 | PDF

The entry of a peak stocking season for new smartphones and PC/NBs, together with the ongoing robustness among AI-related HPC applications...

NAND Flash Market Bulletin_20241009 | TrendForce

NAND Flash Market Bulletin_20241009

Oct 09, 2024 | PDF

Negotiations for 4Q24 contract prices of enterprise SSD are currently ongoing, though the increment has been extensively subsided compared to...

AI Guides Development of Space Industry: Analysis on Applications, Challenges and Market Trends | TrendForce

AI Guides Development of Space Industry: Analysis on Applications, Challenges and Market Trends

Oct 07, 2024 | PDF

AI technology is demonstrating great potential in the space industry. Current practical applications include optimization of fault detection, satellite payload remote sensing, satellite network manage...

Analysis of End-to-End Model Development for Autonomous Driving (Presentation) | TrendForce

Analysis of End-to-End Model Development for Autonomous Driving (Presentation)

Oct 04, 2024 | PDF

1. End-to-End Model 2. Analysis of Key Players in End-to-End Models 3.The Deployment and Challenges of Computational Power for Training 4. TRI’s View

NVIDIA’s Blackwell Ultra to Rename to B300; Stronger Adoption for CoWoS-L GPUs Projected in 2025 to Actuate Expansions of HBM3e 12hi and Liquid-Cooling Solutions | TrendForce

NVIDIA’s Blackwell Ultra to Rename to B300; Stronger Adoption for CoWoS-L GPUs Projected in 2025 to Actuate Expansions of HBM3e 12hi and Liquid-Cooling Solutions

Oct 03, 2024 | PDF

TrendForce forecasts that NVIDIA will focus on promoting its Blackwell B300 series AI chips in 2025, with increased adoption of CoWoS-L packaging and liquid cooling solutions. The B300 series will rep...

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