TrendForce Offers you a complete analysis on DRAM industry wafer input, production output, technology node…etc. by each company.
TrendForce Offers you a complete analysis on NAND Flash industry wafer input, production output, technology node…etc. by each company.
2Q26 foundry revenue rose broadly; overseas, China fab expansion should keep capacity tight, lifting full-year momentum.
2027 HBM talks remain stalled as suppliers push steep price hikes amid AI-driven DRAM crowd-out and tighter capacity.
The explosion of agentic AI services has driven server demand, pushing memory prices and revenues to a peak. Subsequently, end-user consumer electronics were suppressed by high costs, plunging the mar...
Driven by surging demand from AI data centers and ultra-high-speed transmission, Cloud Service Providers (CSPs) are actively securing capacity for Electro-absorption Modulated Lasers (EMLs) and Contin...
This report will provide an in-depth analysis of dynamics across the upstream, midstream, and downstream segments of the SSB industrial chain. It covers capacity expansion and supply chain collaborati...
Geopolitical tension and tight monetary policy keep energy and materials costly, suppressing consumer electronics. Key MLCC inputs remain constrained, while AI servers and data centers drive robust de...
Consumer DRAM remains undersupplied, with contract prices still rising but decelerating as buyer cost tolerance tightens, while spot trading stays subdued. On technology, focus centers on open softwar...
AI demand boosts DRAM/NAND logic. Contract market sees high visibility via agreements, though downstream demand weakens. FMS showcases standard transitions where high-density flash addresses memory-wa...
Major US CSPs expand data centers via both build and lease, as construction lags demand, ushering in a dual-track era.
A sharp spike in the BOM cost of Apple's next-generation flagship has forced even the highly profitable US tech giant to raise retail prices in response. By comparison, the situation is even...
Hyperscale CSPs ramp capex, fueling strong AI server growth as ODMs expand GPU rack output and cooling tech advances.
HBM supply expands as shares shift; 2026 is a pricing pause, 2027 brings a sharp ASP surge as HBM4 rises.
DRAM contracts delayed to Aug. Spot market flat on low volume. CSP demand boosts Korean Q2 results and LTA signings.
