This week’s Bulletin provides an update on the respective markets of Chinese CSPs and corresponding enterprise OEMs...
The US economic data continues to be volatile, with the economy caught between slowing growth and easing inflation. Following the lower-than-expected non-farm payroll numbers for August, the US Labor...
TrendForce indicates that while Samsung, SK Hynix, and Micron have all sampled HBM3e 12hi products, challenges remain in yield ramp-up and qualification, leaving uncertainty over the risk of HBM overs...
In the server DRAM segment, negotiations for 3Q24 contracts are mostly completed, with the focus now shifting to 4Q24...
The sluggishness of demand in the overall market had resulted in inconsistent fluctuations among contract prices of certain components during September...
TSMC has recently activated the stocktaking for its 8-inch capacity, and proposed solutions for revitalizing fab assets, due to the foundry having the largest 8-inch capacity...
From this August to September, HBM suppliers have been unveiling their product development plans for the period between 2025 and 2030 through events like SEMICON Taiwan 2024...
TrendForce indicates that DDR4 and LPDDR4X prices are facing downward pressure due to sluggish consumer demand and CXMT's capacity expansion. Demand for DDR4 in PC, server, and consumer elect...
This week’s Bulletin provides an update on the latest dynamics of server ODMs, CPUs, and GPUs, as well as added updates on the supply chain of server cooling...
Shipments for major products are still ongoing according to negotiated quarterly contract prices...
The contract prices for 3Q24 have largely been set. Conventional DRAM prices are expected to increase by approximately 8-13% QoQ...
