STMicroelectronics

SiC/GaN Power Semiconductors Break "AI Power Wall," Reshaping Data Center Power Supply

Apr 01, 2026 | PDF

In 2026, power semiconductors have evolved from conventional components into strategic enablers reshaping the global energy landscape. SiC and GaN technologies are entering a phase of large-scale depl...

IDMs Seize “China for China” Opportunities through Proactive Collaboration with Chinese Foundries in Development of Manufacturing Processes

Dec 13, 2024 | PDF

TrendForce indicates that heightened geopolitical tensions are driving IDMs to seize ""China for China"" opportunities through collaborations with Chinese foundries...

AMD and NVIDIA Take the Lead in Transitioning to FOPLP for PC CPU, PMIC, and AI GPU to Reduce Cost and Expand Packaging Sizes of Large-Sized Chips

Jun 27, 2024 | PDF

As indicated by the survey of global market intelligence firm TrendForce, chip suppliers such as AMD have been actively involved in negotiations with TSMC and OSAT throughout 2Q24 on chip packaging us...