NVIDIA

Impending Launch of NVIDIA’s Blackwell and B300 Series Will Drive Shipments from Liquid Cooling Supply Chain; GB200 NVL72 Will Adopt Liquid-to-Air (L2A) Cooling Solution by 2025 | TrendForce

Impending Launch of NVIDIA’s Blackwell and B300 Series Will Drive Shipments from Liquid Cooling Supply Chain; GB200 NVL72 Will Adopt Liquid-to-Air (L2A) Cooling Solution by 2025

Oct 30, 2024 | PDF

TrendForce forecasts that shipments of liquid cooling solutions will surge with the launch of NVIDIA's Blackwell and B300 series AI servers. The GB200 NVL72 is expected to adopt a liquid-to-a...

Impending Launch of NVIDIA’s Blackwell and B300 Series Will Drive Shipments from Liquid Cooling Supply Chain; GB200 NVL72 Will Adopt Liquid-to-Air (L2A) Cooling Solution by 2025 | TrendForce

Impending Launch of NVIDIA’s Blackwell and B300 Series Will Drive Shipments from Liquid Cooling Supply Chain; GB200 NVL72 Will Adopt Liquid-to-Air (L2A) Cooling Solution by 2025

Oct 30, 2024 | PDF

According to the latest survey by the global market intelligence firm TrendForce, NVIDIA’s GB200 rack solutions are set to be shipped by the end of this year...

NVIDIA’s Blackwell Ultra to Rename to B300; Stronger Adoption for CoWoS-L GPUs Projected in 2025 to Actuate Expansions of HBM3e 12hi and Liquid-Cooling Solutions | TrendForce

NVIDIA’s Blackwell Ultra to Rename to B300; Stronger Adoption for CoWoS-L GPUs Projected in 2025 to Actuate Expansions of HBM3e 12hi and Liquid-Cooling Solutions

Oct 03, 2024 | PDF

TrendForce’s observations indicate that NVIDIA is currently the global leader of AI chip supplier, and comprises of almost 90% of the GPU AI server market in 2024...

NVIDIA’s Blackwell Ultra to Rename to B300; Stronger Adoption for CoWoS-L GPUs Projected in 2025 to Actuate Expansions of HBM3e 12hi and Liquid-Cooling Solutions | TrendForce

NVIDIA’s Blackwell Ultra to Rename to B300; Stronger Adoption for CoWoS-L GPUs Projected in 2025 to Actuate Expansions of HBM3e 12hi and Liquid-Cooling Solutions

Oct 03, 2024 | PDF

TrendForce forecasts that NVIDIA will focus on promoting its Blackwell B300 series AI chips in 2025, with increased adoption of CoWoS-L packaging and liquid cooling solutions. The B300 series will rep...

The Launch of NVIDIA’s Blackwell and Upgrading of ASICs Will Initiate a Race to Invest in Liquid Cooling across the Supply Chain, and the Penetration Rate of Liquid Cooling for AI Server Chips Will Reach 20-30% in 2025 | TrendForce

The Launch of NVIDIA’s Blackwell and Upgrading of ASICs Will Initiate a Race to Invest in Liquid Cooling across the Supply Chain, and the Penetration Rate of Liquid Cooling for AI Server Chips Will Reach 20-30% in 2025

Sep 11, 2024 | PDF

According to latest research by global market intelligence firm TrendForce, demand in the global AI server market will remain strong through 2024...

The Launch of NVIDIA’s Blackwell and Upgrading of ASICs Will Initiate a Race to Invest in Liquid Cooling across the Supply Chain | TrendForce

The Launch of NVIDIA’s Blackwell and Upgrading of ASICs Will Initiate a Race to Invest in Liquid Cooling across the Supply Chain

Sep 11, 2024 | PDF

TrendForce forecasts that the AI server liquid cooling market will experience rapid growth, driven by the launch of NVIDIA's Blackwell platform and ASIC upgrades, with penetration rate projec...

NVIDIA Over Twofold Growth in FY2Q25 Revenue Driven by Demand for Hopper GPU; New Blackwell Platform May Delay in Shipment Due to Cooling Issues | TrendForce

NVIDIA Over Twofold Growth in FY2Q25 Revenue Driven by Demand for Hopper GPU; New Blackwell Platform May Delay in Shipment Due to Cooling Issues

Aug 29, 2024 | PDF

As indicated by the survey of global market intelligence firm TrendForce, NVIDIA’s latest FY2Q25 financial report shows that the supplier has generated an overall revenue...

AI Accelerates Strategic Integration of Data Centers, Making RoCE a Key Player | TrendForce

AI Accelerates Strategic Integration of Data Centers, Making RoCE a Key Player

Aug 20, 2024 | PDF

AI is becoming increasingly widespread, driving the rapid global expansion of data centers. This growth has led to an elephant flow in the network traffic of data centers, making Ethernet upgrades and...

NVIDIA Plans to Launch B200A Chip to Diversify Its Offerings and Increase Customers’ Interest; This Will Also Further Expand Share of HBM 12hi in Overall HMB Procurement Next Year | TrendForce

NVIDIA Plans to Launch B200A Chip to Diversify Its Offerings and Increase Customers’ Interest; This Will Also Further Expand Share of HBM 12hi in Overall HMB Procurement Next Year

Aug 06, 2024 | PDF

According to the latest research by global market intelligence firm TrendForce, the AI market continues to experience rapid growth. Both GPU suppliers and CSPs are committed to developing AI chips...

Demand for NVIDIA’s Product Lines for High-end GPUs Will Remain Strong in 2025, with YoY Growth Projected at 55%; New Plans for B200A Aim at Diversifying Customer Base among OEMs | TrendForce

Demand for NVIDIA’s Product Lines for High-end GPUs Will Remain Strong in 2025, with YoY Growth Projected at 55%; New Plans for B200A Aim at Diversifying Customer Base among OEMs

Aug 05, 2024 | PDF

TrendForce expects the AI market to maintain high growth throughout the rest of 2024, with global shipments of AI chips projected to increase by...

NVIDIA’s Blackwell GPU Will Become Mainstream in High-end GPU Market with a Share of 83%; Related Demand Will Drive the Growth of Liquid Cooling Supply Chain | TrendForce

NVIDIA’s Blackwell GPU Will Become Mainstream in High-end GPU Market with a Share of 83%; Related Demand Will Drive the Growth of Liquid Cooling Supply Chain

Jul 23, 2024 | PDF

Global market intelligence firm TrendForce reports that NVIDIA is expected to launch a new generation of GPU platform named Blackwell by the end of 2024...

AMD and NVIDIA Take the Lead in Transitioning to FOPLP for PC CPU, PMIC, and AI GPU to Reduce Cost and Expand Packaging Sizes of Large-Sized Chips | TrendForce

AMD and NVIDIA Take the Lead in Transitioning to FOPLP for PC CPU, PMIC, and AI GPU to Reduce Cost and Expand Packaging Sizes of Large-Sized Chips

Jun 27, 2024 | PDF

As indicated by the survey of global market intelligence firm TrendForce, chip suppliers such as AMD have been actively involved in negotiations with TSMC and OSAT throughout 2Q24...

AMD and NVIDIA Take the Lead in Transitioning to FOPLP for PC CPU, PMIC, and AI GPU to Reduce Cost and Expand Packaging Sizes of Large-Sized Chips | TrendForce

AMD and NVIDIA Take the Lead in Transitioning to FOPLP for PC CPU, PMIC, and AI GPU to Reduce Cost and Expand Packaging Sizes of Large-Sized Chips

Jun 27, 2024 | PDF

As indicated by the survey of global market intelligence firm TrendForce, chip suppliers such as AMD have been actively involved in negotiations with TSMC and OSAT throughout 2Q24 on chip packaging us...

Easing of GPU Shortage Allowed Data Center Business to Account for 87% of NVIDIA’s Revenue for FY1Q25; Sources of Demand for AI Servers Expand beyond CSPs to Include Sovereign Cloud and Other Applications | TrendForce

Easing of GPU Shortage Allowed Data Center Business to Account for 87% of NVIDIA’s Revenue for FY1Q25; Sources of Demand for AI Servers Expand beyond CSPs to Include Sovereign Cloud and Other Applications

May 24, 2024 | PDF

Global market intelligence firm TrendForce reports that this year, NVIDIA’s revenue growth is primarily being driven by the demand from major North American CSPs, server brands (OEMs)...

A Glimpse into the Adoption Challenges and Technological Planning of TSMC’s 3nm Technology from the TSMC Techonology Synposium | TrendForce

A Glimpse into the Adoption Challenges and Technological Planning of TSMC’s 3nm Technology from the TSMC Techonology Synposium

May 10, 2024 | PDF

TSMC president C.C. Wei was questioned by analysts about the potential introduction of High-NA EUV during TSMC’s 4Q23 earnings call. He responded, “Because of technology itself is no value. Only when...

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