SEMICON Taiwan 2026 highlights MEMS shifting from single-mode to multimodal sensing, enabling humanoid edge AI and e-skin, with scale adoption in 2028-2030 reshaping the sensor supply chain.
AI-driven advanced packaging demand is reshaping the probe card market, boosting margins and triggering a major shift in global supplier rankings.
AI-driven HPC demand has elevated probe card technology, from MEMS upgrades to silicon interposers, while ATE leaders accelerate vertical integration.
1. Google is consolidating its proprietary TPUs, Ironwood racks, 3D Torus topology, and the Apollo OCS optical backbone into a unified high-speed interconnect architecture. As a result, the focus of c...
Google integrates TPU v7/v8, Ironwood racks, and Apollo OCS into a unified fabric, shifting the scaling unit from servers to racks. This drives 800G+ optical module penetration above 60% by 2026. Supp...
