CoWoS

CoWoS Expected at Twofold Growth in 2025 from Demand of Blackwell and CSPs’ ASICs; Progress to Depend on Supply Expansions and Preparation of GB Racks | TrendForce

CoWoS Expected at Twofold Growth in 2025 from Demand of Blackwell and CSPs’ ASICs; Progress to Depend on Supply Expansions and Preparation of GB Racks

Jan 07, 2025 | PDF

TrendForce forecasts that CoWoS capacity will double in 2025, driven by demand for Blackwell and CSPs' ASICs. TSMC, the major supplier, will expand capacity to meet the demand, with N...

CoWoS Expected at Twofold Growth in 2025 from Demand of Blackwell and CSPs’ ASICs; Progress to Depend on Supply Expansions and Preparation of GB Racks | TrendForce

CoWoS Expected at Twofold Growth in 2025 from Demand of Blackwell and CSPs’ ASICs; Progress to Depend on Supply Expansions and Preparation of GB Racks

Jan 07, 2025 | PDF

Major CoWoS supplier TSMC continues to expand its capacity alongside the ongoing growth in demand for AI chips, such as GPUs and ASICs of CSPs. TSMC came to a total CoWoS capacity of...

NVIDIA’s Blackwell Ultra to Rename to B300; Stronger Adoption for CoWoS-L GPUs Projected in 2025 to Actuate Expansions of HBM3e 12hi and Liquid-Cooling Solutions | TrendForce

NVIDIA’s Blackwell Ultra to Rename to B300; Stronger Adoption for CoWoS-L GPUs Projected in 2025 to Actuate Expansions of HBM3e 12hi and Liquid-Cooling Solutions

Oct 03, 2024 | PDF

TrendForce’s observations indicate that NVIDIA is currently the global leader of AI chip supplier, and comprises of almost 90% of the GPU AI server market in 2024...

NVIDIA’s Blackwell Ultra to Rename to B300; Stronger Adoption for CoWoS-L GPUs Projected in 2025 to Actuate Expansions of HBM3e 12hi and Liquid-Cooling Solutions | TrendForce

NVIDIA’s Blackwell Ultra to Rename to B300; Stronger Adoption for CoWoS-L GPUs Projected in 2025 to Actuate Expansions of HBM3e 12hi and Liquid-Cooling Solutions

Oct 03, 2024 | PDF

TrendForce forecasts that NVIDIA will focus on promoting its Blackwell B300 series AI chips in 2025, with increased adoption of CoWoS-L packaging and liquid cooling solutions. The B300 series will rep...

Rise of AI Applications Has Triggered a Wave of Demand for CoWoS, Leading Taiwan-based Equipment Providers to Fully Commit to Developing Chip Packaging Solutions | TrendForce

Rise of AI Applications Has Triggered a Wave of Demand for CoWoS, Leading Taiwan-based Equipment Providers to Fully Commit to Developing Chip Packaging Solutions

Aug 23, 2024 | PDF

According to research by the global market intelligence firm TrendForce, the global AI server market has been experiencing rapid growth over the years...

Trends and Competitions of AI Chip Market under Era of Gen AI | TrendForce

Trends and Competitions of AI Chip Market under Era of Gen AI

Mar 05, 2024 | PDF

The AI chip is undoubtedly the lifebuoy of the technology industry in 2023, creating new vitality in the industry downturn. In 2024, this wave will undoubtedly continue to sweep through the industry w...

As Diverse Applications Drive Market Growth of HBM, 2.5D Packaging Plays a Critical Role in Development of This Memory Solution | TrendForce

As Diverse Applications Drive Market Growth of HBM, 2.5D Packaging Plays a Critical Role in Development of This Memory Solution

Jun 20, 2023 | PDF

Cloud computing workloads continue to increase rapidly due to the demand coming from a diverse range of applications. However, the limited room for DDR SDRAM to achieve further breakthroughs...

Analysis on Development Trends of Liquid Cooling Technology for Data Centers | TrendForce

Analysis on Development Trends of Liquid Cooling Technology for Data Centers

Jun 15, 2023 | PDF

Thermal Design Power (TDP), as server chips improve in computability, is constantly surpassing the limit of power consumption amidst the incessant increase of temperature during summertime under clima...

Opportunities in Markets for PSUs and Liquid Cooling Solutions Generated by Rapid Growth of AI Servers | TrendForce

Opportunities in Markets for PSUs and Liquid Cooling Solutions Generated by Rapid Growth of AI Servers

Jun 14, 2023 | PDF

1. Projection on Development of AI Server Market 2. Comparison of AI Servers and Convention Servers in Terms of Energy Consumption 3. Development Trends in Higher-Spec PSUs and Liquid Cooling Soluti...

As Diverse Applications Drive Market Growth of HBM, 2.5D Packaging Plays a Critical Role in Development of This Memory Solution | TrendForce

As Diverse Applications Drive Market Growth of HBM, 2.5D Packaging Plays a Critical Role in Development of This Memory Solution

Jun 09, 2023 | PDF

The load of cloud computing will continue to elevate under the advancement of diversified applications, where restricted growth of performance in DDR SDRAM could encumber the performance of computing...

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