AI Infrastructure

IC and Semi Research Report-3Q26 | TrendForce

IC and Semi Research Report-3Q26

Jul 29, 2026 | PDF

From a professional analyst's perspective, the global semiconductor market is strongly driven by surge in artificial intelligence and cloud computing, boosting high-performance chips and opti...

Global Capex Rises as China Builds AI Autonomy | TrendForce

Global Capex Rises as China Builds AI Autonomy

Jul 28, 2026 | PDF

Global Capex rises on AI buildout as China speeds self-reliant chips, easing foreign hardware reliance.

Server Market Bulletin - Jul. 23, 2026 | TrendForce

Server Market Bulletin - Jul. 23, 2026

Jul 23, 2026 | PDF

Global AI server momentum builds as CSPs expand rack buys, hyperscalers advance in-house chips, and OEM orders grow.

MLCC Market Bulletin - Jul. 21, 2026 | TrendForce

MLCC Market Bulletin - Jul. 21, 2026

Jul 21, 2026 | PDF

AI demand surges high-end MLCC shipments, prompting Japanese and Korean suppliers to shift consumer-grade capacity, creating gaps that Taiwanese and Chinese firms partially fill. Yet geopolitical risk...

AI Infra Market Bulletin – Jul. 16, 2026 | TrendForce

AI Infra Market Bulletin – Jul. 16, 2026

Jul 16, 2026 | PDF

As global computing power expands, traditional cabling faces severe thermal and power bottlenecks. Emerging Micro LED CPO technology, with its micron-level size and ultra-low power consumption, has be...

Server Market Bulletin - Jul. 9, 2026 | TrendForce

Server Market Bulletin - Jul. 9, 2026

Jul 09, 2026 | PDF

CSP capex growth lifts server and AI shipments, chip forecasts rise, ODMs shift to racks, cooling gains traction.

MLCC Market Bulletin - Jul. 9, 2026 | TrendForce

MLCC Market Bulletin - Jul. 9, 2026

Jul 09, 2026 | PDF

Strong demand for AI servers and in‑house chip platforms is driving structural shortages in high‑end and mid‑high‑cap MLCCs. Inflation and high interest rates are suppressing end‑market consumption, f...

AI Infra Market Bulletin – Jul. 2, 2026 | TrendForce

AI Infra Market Bulletin – Jul. 2, 2026

Jul 02, 2026 | PDF

Photonic packaging drives AI infra, shifting to mass production. CPO and glass platforms solve bottlenecks.

MLCC Price Jun. 2026 | TrendForce

MLCC Price Jun. 2026

Jun 30, 2026 | PDF

AI capacity crowding tightens high-end MLCC supply while consumer demand weakens under inflation. Channels and some Taiwanese/Chinese makers selectively raise prices, yet Japanese and Korean firms hol...

AI Infra Market Bulletin – Jun. 25, 2026 | TrendForce

AI Infra Market Bulletin – Jun. 25, 2026

Jun 25, 2026 | PDF

AI drives data centers from air to liquid cooling. Vendors deploy high-density power and tech, boosting growth.

MLCC Market Bulletin - Jun. 18, 2026 | TrendForce

MLCC Market Bulletin - Jun. 18, 2026

Jun 18, 2026 | PDF

AI-driven demand is crowding out capacity and pressuring MLCC supply, while high interest rates and inflation weigh on consumer electronics recovery. Distributor hoarding and price hikes have triggere...

Server Market Bulletin - Jun. 18, 2026 | TrendForce

Server Market Bulletin - Jun. 18, 2026

Jun 18, 2026 | PDF

Global server growth accelerates in 2026 as CSPs expand AI infrastructure investment and custom silicon adoption reshapes procurement strategies.

AI Infra Market Bulletin – Jun. 11, 2026 | TrendForce

AI Infra Market Bulletin – Jun. 11, 2026

Jun 11, 2026 | PDF

The year 2026 marks the watershed transition of AI data center optical interconnects from adoption to mass production. The actual volume driver is not scale-out CPO switches, but GPU scale-up networks...

DRAM Market Bulletin - Jun. 10, 2026 | TrendForce

DRAM Market Bulletin - Jun. 10, 2026

Jun 10, 2026 | PDF

Contract negotiations extend as suppliers prioritize major American clients, while spot prices rise on strong demand. AI adoption reshapes memory specifications toward higher bandwidth and lower power...

MLCC Market Bulletin - Jun. 8, 2026 | TrendForce

MLCC Market Bulletin - Jun. 8, 2026

Jun 08, 2026 | PDF

Strong AI demand concentrates high-end MLCC specifications while weak consumer electronics shift capacity toward AI servers. CSP custom ASICs trigger frequent design changes, tightening supply and ext...

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