Samsung LSI + Foundry generated roughly US$4.04 billion (calculation based on US$1=KRW$1,315.68) of revenue in 2Q23 under an approximate QoQ increase of 17.3% attributable to...
TSMC generated US$15.66 billion (calculation based on US$1=NT$30.7124) of revenue in 2Q23 under a QoQ reduction of roughly 6.4%, which largely coincided with the upper end of its financial forecast...
Samsung’s new fab (Line S6) in Taylor will be segmented into two phases. Phase 1 is planned as a 4nm fab at an approximate capacity of 30Kwspm that is scheduled for official mass production at the end...
Cloud computing workloads continue to increase rapidly due to the demand coming from a diverse range of applications. However, the limited room for DDR SDRAM to achieve further breakthroughs...
Phase 1 for TSMC’s Japanese fab (JASM) is scheduled for a mass production in December 2024 at a preliminary capacity of about 5Kwspm...
Thermal Design Power (TDP), as server chips improve in computability, is constantly surpassing the limit of power consumption amidst the incessant increase of temperature during summertime under clima...
The load of cloud computing will continue to elevate under the advancement of diversified applications, where restricted growth of performance in DDR SDRAM could encumber the performance of computing...
Samsung Device Solutions (DS) is divided into four divisions, including Memory, System LSI, Foundry, and Advanced Package (AVP)...
The utilization of chiplets paired with 2.5D and 3D advanced packaging technology is bound to become one of the inevitable development trends of high-end chips in order to allow a continuous elevation...
Terminal sales that have yet to see a recovery, together with the worse-than-expected reduction of inventory among upstream IC design clients...
Off season in the consumer market, together with inventory revisions among clients, had affected Samsung Foundry’s performance in shipment and capacity utilization, which shrank its 1Q23 revenue to...
TSMC mentioned from its earnings call on April 20th that the foundry had suffered a QoQ drop of 12.8% in 1Q23 wafer shipment under clients’ inventory revisions...
The subsidy specifications of the CHIPS Act by the US government restrict applicants’ investment on 1X nm and below advanced nodes, as well as 28nm and above matured nodes...
The subsidization regulations from the CHIPS Act, issued by the US Department of Commerce on March 21st...
Pertaining to how UMC mentioned from its 4Q22 earnings call that the HV (High Voltage) process would evolve from the current mainstream 28nm to 17nm in the future...
