Advanced Packaging

HBM Market Bulletin - Jun. 13, 2025 | TrendForce

HBM Market Bulletin - Jun. 13, 2025

Jun 13, 2025 | PDF

HBM4 pricing shows a premium over HBM3e due to increased complexity and cost in manufacturing and design.

Foundry Market Bulletin_20250602 | TrendForce

Foundry Market Bulletin_20250602

Jun 02, 2025 | PDF

Regarding changes to orders and capacity utilization of TSMC for 2H25, advanced nodes, including 3nm and 5/4nm...

Breakthroughs Still Needed in Critical Equipment: China’s Alternative Paths to Advanced Chip Independence | TrendForce

Breakthroughs Still Needed in Critical Equipment: China’s Alternative Paths to Advanced Chip Independence

May 22, 2025 | PDF

This report tracks the current restrictions on semiconductor technology faced by Chinese companies, analyzes recent developments in China’s semiconductor equipment sector, and ultimately focuses on ho...

Hybrid Bonding Technology Heralds a New Era in Advanced Semiconductor Packaging | TrendForce

Hybrid Bonding Technology Heralds a New Era in Advanced Semiconductor Packaging

May 21, 2025 | PDF

As indicated by the survey of global market intelligence firm TrendForce, for decades, Moore's Law has driven the exponential growth of the semiconductor industry...

Foundry Market Bulletin_20250519 | TrendForce

Foundry Market Bulletin_20250519

May 19, 2025 | PDF

Samsung Foundry, due to its client composition, is not benefitting much from China’s subsidies. The combined revenue of Samsung Foundry and System LSI...

Analysis of TSMC’s North America Technology Symposium: Unveiling of Roadmap for Advanced Packaging Solutions and Related Strategy | TrendForce

Analysis of TSMC’s North America Technology Symposium: Unveiling of Roadmap for Advanced Packaging Solutions and Related Strategy

May 07, 2025 | PDF

"TSMC's North America Technology Symposium unveiled a roadmap for advanced packaging solutions, showcasing the 3DFabric® platform, which includes wafer level 3D stacking and advanced packagi...

Analysis of TSMC’s North America Technology Symposium: Unveiling of Roadmap for Advanced Packaging Solutions and Related Strategy | TrendForce

Analysis of TSMC’s North America Technology Symposium: Unveiling of Roadmap for Advanced Packaging Solutions and Related Strategy

May 07, 2025 | PDF

For decades, the semiconductor industry has thrived by adhering to Moore’ Law, achieving rapid development through the continuous miniaturization of transistors...

Foundry Market Bulletin_20250505 | TrendForce

Foundry Market Bulletin_20250505

May 05, 2025 | PDF

TSMC mentioned at the 1Q25 earnings call that 30% of 2nm capacity will be established at its Arizona fab in the future...

Top 10 Global OSAT Companies in 2024—Mature Leaders Stay Strong While New Regional Forces Emerge | TrendForce

Top 10 Global OSAT Companies in 2024—Mature Leaders Stay Strong While New Regional Forces Emerge

May 05, 2025 | PDF

"TrendForce's 2024 OSAT report highlights packaging's rising importance due to Moore's Law limits and chip complexity. Asian firms dominate, with Taiwan maintaining...

Foundry Market Bulletin_20250421 | TrendForce

Foundry Market Bulletin_20250421

Apr 21, 2025 | PDF

Regarding Samsung’s partnerships and negotiations with clients of advanced nodes, Samsung Foundry had previously concluded negotiations with Qualcomm on the 8 series flagship chips through SF2...

Activation of Sovereign AI: Opportunities and Challenges on Chips and Advanced Packaging Technology | TrendForce

Activation of Sovereign AI: Opportunities and Challenges on Chips and Advanced Packaging Technology

Apr 17, 2025 | PDF

Geopolitical instability has fostered the rising consciousness of sovereign AI in 2025, thus prompting the US, Europe, China, and Japan to successively revitalize their domestic chip industries. These...

Foundry Market Bulletin_20250407 | TrendForce

Foundry Market Bulletin_20250407

Apr 07, 2025 | PDF

Last issue of the Bulletin mentioned how TSMC’s additional investment in the US has also actuated its deployment strategies in other regions of the world...

Foundry Market Bulletin_20250324 | TrendForce

Foundry Market Bulletin_20250324

Mar 24, 2025 | PDF

Looking at changes to Samsung Foundry’s 8-inch orders for 2025, the tendency of localized China for China production...

Foundry Market Bulletin_20250310 | TrendForce

Foundry Market Bulletin_20250310

Mar 10, 2025 | PDF

TSMC announced on March 4th to be investing US$100 billion in the US for three new phases, two advanced packaging plants, and one R&D center, in Arizona...

TSMC Expands US Investment to US$165 Billion; US Share of Global Advanced Foundry Capacity Will Rise to 22% by 2030 | TrendForce

TSMC Expands US Investment to US$165 Billion; US Share of Global Advanced Foundry Capacity Will Rise to 22% by 2030

Mar 04, 2025 | PDF

TrendForce indicates that TSMC is expanding its US investment to US$165 billion, establishing six advanced process fabs, two advanced packaging plants, and an R&D center in Arizona. Geopolitical t...

Get in touch with us


Get in touch with us