Advanced-process expansion and layouts for both Chinese foundries and GlobalFoundries, stressing supply autonomy and cross-border investment amid strategic shifts for long-term needs.
AI-driven demand push chiplet-based packaging; EMIB costs less than CoWoS, signaling a move to modular, efficient interconnects.
The latest Foundry Newsletter reports analyzes the global foundry market, noting demand-supply dynamics, yield issues across fabs, and shifting supply chains amid uncertainty.
AI-driven data centers evolve from single-chip to heterogeneous multi-GPU architectures. High-speed optical interconnects enable scalability, while silicon photonics and co-packaged optics boost bandw...
Strong domestic demand in China is pushing 8-inch foundry utilization to full capacity, prompting price hikes and expansion plans. Clients are securing advanced node capacity through strategic partner...
The latest Foundry Newsletter reports that leading wafer foundries have stabilized capacity due to major customer orders. Capacity utilization in the second half is better than expected. Focus is on e...
The global foundry landscape is stabilizing, with leading and regional players staying productive; pricing and localization drive growth.
The surge in AI applications has fueled the development and growth of the semiconductor industry but has also brought new challenges. Apart from advanced process technology nearing physical limits and...
In 2026, Taiwan’s major foundries increase utilization; PSMC grows with new partnerships, UMC stable, Vanguard benefits from premium capacity and new fab, while TSMC’s advanced nodes remain fully util...
Driven by policy support and market demand, leading foundries improved capacity utilization and revenue growth, with new capacity expanding, and diversified platform development showing positive resul...
This report analyzes TSMC, UMC, and PSMC's recent operations and industry outlook, focusing on new plant investments, capacity utilization, product mix, and future technology roadmaps, as well as memo...
Samsung restarts US plant expansion driven by policy, but timeline and capacity growth remain uncertain; 2nm order progress depends on yield and client decisions, requiring further observation.
Glass substrates are emerging as a highly promising solution in advanced semiconductor packaging with recent breakthroughs in Through-Glass Via (TGV) technology. They are poised to drive innovation in...
UMC focuses on mature processes in China with limited expansion; main growth is in Singapore fab, while Vanguard accelerates capacity in the new Singapore fab, surpassing industry growth.
Foundry Market Update: Samsung utilization rate stable, clients adjust supply chains strategically; China foundry development continues, new processes and regional capacity layouts key.
