3D IC

2026 3D IC Outlook: SoIC Ramp-Up, Rise of STCO

Sep 04, 2026 | PDF

In the OCP APAC Summit held in August 2026, suppliers including TSMC, ASE, and AMAT all highlighted the future trends of 3D IC. In September, during SEMICON, the 3DIC Advanced Manufacturing Alliance (...

Hybrid Bonding Technology Heralds a New Era in Advanced Semiconductor Packaging

May 21, 2025 | PDF

As indicated by the survey of global market intelligence firm TrendForce, for decades, Moore's Law has driven the exponential growth of the semiconductor industry...

Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

Mar 13, 2025 | PDF

"TrendForce reports AI drives higher NAND Flash transmission performance demands. Samsung, to seize AI edge computing opportunities, accelerates Hybrid Bonding adoption in its V9 (286L) produ...

Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

Mar 13, 2025 | PDF

The booming progression of AI has prompted the demand for increasing performance of storage devices...

From 2.5D to 3D: Key Processes of Hybrid Bonding and Strategies of Equipment Providers

Jun 05, 2024 | PDF

Under the influence of growing AI-related demand and the slowing pace of node migration under Moore’s Law, achieving lower power consumption and higher transistor counts on a single chip has become a...

Hybrid Bonding Technology Portrays Essential Role as Advanced Packaging Continues to Evolve

May 31, 2023 | PDF

The utilization of chiplets paired with 2.5D and 3D advanced packaging technology is bound to become one of the inevitable development trends of high-end chips in order to allow a continuous elevation...