According to Wccftech, TSMC might delay its adoption of High-NA EUV, with the company expected to bypass the tool for its A14 process and instead continue using 0.33-NA EUV, a move revealed by Senior Vice President Kevin Zhang at the NA Technology Symposium and noted by BITS&CHIPS. Still, the...

According to Bloomberg, sources indicate that Sony Group is weighing the spin-off of its semiconductor subsidiary, Sony Semiconductor Solutions, with an IPO potentially taking place as early as this year. Another report from Bloomberg adds that the move would mark the PlayStation maker’s lates...

YMTC, known for its hybrid bonding patent deal with Samsung and its push toward 294-layer NAND production, has quietly revealed mounting losses. Financial disclosures tied to an investment by Hebei Yangyuan Zhihui Beverage Co showed that YMTC posted an 84 million yuan (about US$11.6 million) loss in...

It’s reported that a team of 30 scientists from the Indian Institute of Science (IISc) has submitted a proposal to the government to develop Angstrom-scale chips, which will leverage new semiconductor technologies based on two-dimensional (2D) materials. The proposal suggests that using these adva...

Intel’s new CEO, Lip-Bu Tan, has just completed his first earnings call, demonstrating a strong commitment to driving the company’s transformation. As noted by a report from Commercial Times, Intel’s next-generation CPU, Nova Lake, will combine in-house production with outsourcing to TSMC for ...