NVIDIA still leads in the AI chip race, but its global AI infrastructure push recently may reflect concerns that hardware growth may slow—and that CSPs ramping up ASIC development could become serious challengers. According to Commercial Times, as Google, Microsoft, and Meta ramp up in-house ASIC ...

According to Economic Daily News, fan-out panel-level packaging (FOPLP) is regarded as the next mainstream technology in advanced packaging. Key industry players—including foundry giant TSMC, semiconductor packaging and testing leader ASE, and memory packaging powerhouse Powertech—are actively i...

With leading memory makers like Samsung and Micron winding down DDR4 production and prices surging, Taiwan’s major supplier Nanya Technology has reportedly paused price quotes, signaling tightening supply and growing demand, according to Economic Daily News. Industry sources further explain tha...

Recently, during the VivaTech conference in Paris, French President Emmanuel Macron emphasized that France must gain mastery over advanced semiconductor manufacturing processes in the 2 to 10-nanometer range, securing an irreplaceable role in the global technology supply chain. In recent years, F...

According to Nikkei, Chinese automakers such as SAIC Motor, Changan, Great Wall Motor, BYD, Li Auto, and Geely are reportedly preparing to launch vehicles equipped entirely with domestically produced chips, with at least two brands targeting mass production as early as 2026. The report, citing so...