TSMC is accelerating its U.S. push, with its third Arizona fab (F21 P3) reportedly breaking ground in Q2. Still, the foundry giant is playing catch-up—Treasury Secretary Scott Bessent revealed TSMC’s Arizona site currently meets just 7% of U.S. chip demand, according to Wccftech via The The All-...

According to Tom’s Hardware, citing CRN, Intel is spinning off its Network and Edge Group (NEX) into an independent business unit. In a memo to customers, the company revealed its plan to seek external investment for the NEX unit. As CRN notes, an Intel spokesperson has confirmed the details outli...

After grappling with 2nm yield challenges and failing to lock in major clients, Samsung is making a bold comeback. According to Digital Daily and Reuters, the company has announced a massive foundry deal worth over 22.7 trillion won (nearly $17 billion)—a potential game-changer for its chip busine...

As per Korean media The Elec, LG Display (LGD) is planning to evaluate non-FMM panel technology, which eliminates the need for Fine Metal Mask (FMM) by adopting semiconductor photolithography processes to produce OLED panels. Unlike conventional FMM methods, this technology deposits organic material...

According to a ZDNet report citing industry sources on the 25th, leading global semiconductor back-end equipment manufacturers are expected to expand their HBM hybrid bonding operations in the second half of 2025. BESI Expects Rising Hybrid Bonding Orders in H2 2025 On July 24, Dutch equipment...